Roy Goldman Email
IC failure analysis leader @ NVIDIA
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Roy Goldman Location
- Haifa District, Israel
Roy Goldman Work
- IC failure analysis leader @ (March 2024 - Present)
- Assembly engineering and failure analysis manager @ (October 2022 - March 2024)
- Failure analysis manager @ (January 2016 - October 2022)
- Senior failure analysis engineer @ (April 2012 - December 2015)
- Device student @ (March 2010 - April 2012)
- Materials Engineer @ (November 2006 - March 2010)
Roy Goldman Education
- Tel Aviv University
M.Sc (Nanotechnology program)
2008-2015 - Ben Gurion University
B.Sc (Physics)
2002-2006 - Ben Gurion University
B.Sc (Materials engineering)
2002-2006
Roy Goldman Skills
- Physics
- Device Characterization
- Scanning Electron Microscopy
- Nanotechnology
- Device Physics
- JMP
- Materials
- Research And Development R&D
- Process Integration
- Process Control
- CMOS
- Semiconductor Industry
- Materials Engineer
- Manufacturing
- Failure Analysis
- Semiconductors
- Design
- Physical Design
- Research
- Flash Memory
- Analysis
- Materials Science
- Yield
- Research and Development
Roy Goldman Summary
- Roy Goldman, based in Haifa District, Israel, is currently a IC failure analysis leader at NVIDIA. Roy Goldman brings experience from previous roles at Amazon Web Services (AWS), Marvell Semiconductor and Micron Technology. Roy Goldman holds a 2008 - 2015 M.Sc in Nanotechnology program @ Tel Aviv University. With a robust skill set that includes Physics, Device Characterization, Scanning Electron Microscopy, Nanotechnology, Device Physics and more. Roy Goldman has 2 emails on RocketReach.
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