Robin Lien Email
Package Technologist Lead @ Google
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Robin Lien Location
- Taiwan
Robin Lien Work
- 2021 -now Package Technologist Lead @
- 2019 -2021 Senior Technical Manager @
- 2017 -2019 Section Manager @
- 2014 -2017 Manager, Advanced Package RD @
- 2013 -2014 Senior Manager @
- 2012 -2012 Serion Engineer @
- 2000 -2012 Principal Engineer @
Robin Lien Education
- Chang Gung University
Master's degree (Mechanical Engineering)
1996-1998
Robin Lien Summary
- Robin Lien, based in Taiwan, is currently a Package Technologist Lead at 谷歌. Robin Lien brings experience from previous roles at 聯發科, 台積電, Micron Technology and NXP Semiconductors. Robin Lien holds a 1996 - 1998 Master's degree in Mechanical Engineering @ Chang Gung University. Robin Lien has 2 emails on RocketReach.
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