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Robin Lien Location
Taiwan
Robin Lien Work
Package Technologist Lead @ (June 2021 - Present)
Senior Technical Manager @ (April 2019 - June 2021)
Section Manager @ (September 2017 - March 2019)
Manager, Advanced Package RD @ (December 2014 - September 2017)
Senior Manager @ (January 2013 - December 2014)
Serion Engineer @ (April 2012 - October 2012)
Principal Engineer @ (May 2000 - April 2012)
Robin Lien Education
Chang Gung University
Master's degree (Mechanical Engineering)
1996-1998
Robin Lien Summary
Robin Lien, based in Taiwan, is currently a Package Technologist Lead at 谷歌. Robin Lien brings experience from previous roles at 聯發科, 台積電, Micron Technology and NXP Semiconductors. Robin Lien holds a 1996 - 1998 Master's degree in Mechanical Engineering @ Chang Gung University. Robin Lien has 2 emails on RocketReach.
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