Robin Lien, based in Taiwan, is currently a Package Technologist Lead at 谷歌. Robin Lien brings experience from previous roles at 聯發科, 台積電, Micron Technology and NXP Semiconductors. Robin Lien holds a 1996 - 1998 Master's degree in Mechanical Engineering @ Chang Gung University. Robin Lien has 2 emails on RocketReach.
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