Robert Burck Email
Mold Design - Project Engineer @ Molex
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Robert Burck Location
- Chengdu, Sichuan, China
Robert Burck Work
- 2013 -now Mold Design - Project Engineer @
- 1998 -2015 Mold Design Supervisor @
Robert Burck Education
- Schoolcraft College
- University of Michigan school of Architecture and Design
(2-Dimensional Design Major, Art Histroy Minor)
Robert Burck Skills
- Six Sigma
- Injection Molding
- Product Development
- Electronics
- Design for Manufacturing
- SPC
- FMEA
- Lean Manufacturing
- Manufacturing
- Product Design
- GD&T
Robert Burck Summary
- Robert Burck, based in Chengdu, Sichuan, China, is currently a Mold Design - Project Engineer at Molex. Robert Burck brings experience from previous roles at Molex Transporation Auburn Hills. Robert Burck holds a Schoolcraft College. With a robust skill set that includes Six Sigma, Injection Molding, Product Development, Electronics, Design for Manufacturing and more. Robert Burck has 2 emails on RocketReach.
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