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Qian Ding Location
San Jose, CA, US
Qian Ding Work
2025 -now Principal IC Design Engineer @
2018 -2025 Packaging R and D Engineer @
2015 -2017 Hardware Engineer in Packaging and PCB Technologies @
2011 -2015 Packaging Engineer @
2009 -2013 Research Assistant and Engineering Aid @ Computational Electromagnetics group/ Center for Magnetic Recording Research
2011 -2011 Teaching Assistant of Antennas and Their System Applications @ ECE Dept. of UCSD
2011 -2011 Teaching Assistant of Components and Circuits Lab @ ECE Dept. of UCSD
2011 -2011 Teaching Assistant of Signals and Systems @ MAE Dept. of UCSD
Qian Ding Education
University of California, San Diego
MS (Electrical Engineering)
2009-2012
Northwestern Polytechnical University, Xi'an, Shaanxi, China
MS (Electromagnetic field and Microwave Technology)
2007-2009
Qian Ding Summary
Qian Ding, based in San Jose, CA, US, is currently a Principal IC Design Engineer at Broadcom. Qian Ding brings experience from previous roles at Intel Corporation, Oracle, Entropic Communications and Computational Electromagnetics group/ Center for Magnetic Recording Research. Qian Ding holds a 2009 - 2012 MS in Electrical Engineering @ University of California, San Diego. Qian Ding has 4 emails and 2 mobile phone numbers on RocketReach.
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