Qian Ding Email & Phone Number
Principal IC Design Engineer @ Broadcom
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Qian Ding Location
- San Jose, CA, US
Qian Ding Work
- Principal IC Design Engineer @ (March 2025 - Present)
- Packaging R and D Engineer @ (February 2018 - March 2025)
- Hardware Engineer in Packaging and PCB Technologies @ (August 2015 - November 2017)
- Packaging Engineer @ (December 2011 - May 2015)
- Research Assistant and Engineering Aid @ Computational Electromagnetics group/ Center for Magnetic Recording Research (September 2009 - September 2013)
- Teaching Assistant of Antennas and Their System Applications @ ECE Dept. of UCSD (September 2011 - December 2011)
- Teaching Assistant of Components and Circuits Lab @ ECE Dept. of UCSD (April 2011 - June 2011)
- Teaching Assistant of Signals and Systems @ MAE Dept. of UCSD (January 2011 - March 2011)
Qian Ding Education
- University of California, San Diego
MS (Electrical Engineering)
2009-2012 - Northwestern Polytechnical University, Xi'an, Shaanxi, China
MS (Electromagnetic field and Microwave Technology)
2007-2009
Qian Ding Summary
- Qian Ding, based in San Jose, CA, US, is currently a Principal IC Design Engineer at Broadcom. Qian Ding brings experience from previous roles at Intel Corporation, Oracle, Entropic Communications and Computational Electromagnetics group/ Center for Magnetic Recording Research. Qian Ding holds a 2009 - 2012 MS in Electrical Engineering @ University of California, San Diego. Qian Ding has 4 emails and 2 mobile phone numbers on RocketReach.
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