Pat Seitz's Location
Chicago, IL, US
Pat Seitz's Work
Pat Seitz's Education
Pat Seitz's Summary
Pat Seitz, based in Chicago, IL, US, is currently a Vice President Packaging Division at Herrmann Ultrasonics, bringing experience from previous roles at Felsomat USA, Inc - Reishauer Group, Reishauer Corp. and Reishauer AG. Pat Seitz holds a 2000 - 2007 Master of Engineering (MEng) in Mechanical Engineering @ Eidgenössische Technische Hochschule Zürich. Pat Seitz has 1 email on RocketReach.