Pat Seitz's Location

Chicago, IL, US

Pat Seitz's Work

Pat Seitz's Education

  • Eidgenössische Technische Hochschule Zürich

    Master of Engineering (MEng) (Mechanical Engineering)

    2000 - 2007

Pat Seitz's Summary

Pat Seitz, based in Chicago, IL, US, is currently a Vice President Packaging Division at Herrmann Ultrasonics, bringing experience from previous roles at Felsomat USA, Inc - Reishauer Group, Reishauer Corp. and Reishauer AG. Pat Seitz holds a 2000 - 2007 Master of Engineering (MEng) in Mechanical Engineering @ Eidgenössische Technische Hochschule Zürich. Pat Seitz has 1 email on RocketReach.

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