Pat Seitz's Location
Chicago, Illinois, United States
Pat Seitz's Work
Pat Seitz's Education
Pat Seitz's Skills
Pat Seitz's Summary
Pat Seitz, based in Chicago, Illinois, United States, is currently a Vice President Packaging Division at Herrmann Ultrasonics, bringing experience from previous roles at Felsomat Usa, Inc, Reishauer Corp and Reishauer Ag. Pat Seitz holds a 2000 - 2007 Master of Engineering in Engineering, Mechanical Engineering @ ETH Zürich. With a robust skill set that includes Project Management, Manufacturing Engineering, Sales, Machine Tools, Automation and more, Pat Seitz contributes valuable insights to the industry. Pat Seitz has 3 emails on RocketReach.