Pat Seitz's Location

Chicago, Illinois, United States

Pat Seitz's Work

Pat Seitz's Education

  • ETH Zürich

    Master of Engineering (Engineering, Mechanical Engineering)

    2000 - 2007

Pat Seitz's Skills

  • Project Management
  • Manufacturing Engineering
  • Sales
  • Machine Tools
  • Automation
  • Automotive
  • Engineering
  • Engineering Management
  • Product Development
  • Manufacturing Operations Management

Pat Seitz's Summary

Pat Seitz, based in Chicago, Illinois, United States, is currently a Vice President Packaging Division at Herrmann Ultrasonics, bringing experience from previous roles at Felsomat Usa, Inc, Reishauer Corp and Reishauer Ag. Pat Seitz holds a 2000 - 2007 Master of Engineering in Engineering, Mechanical Engineering @ ETH Zürich. With a robust skill set that includes Project Management, Manufacturing Engineering, Sales, Machine Tools, Automation and more, Pat Seitz contributes valuable insights to the industry. Pat Seitz has 3 emails on RocketReach.

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