2018 -
2025 Sr. Technical Director, Packaging Development @
2018 -
2025 Technologist @ Barefoot Networks
2015 -
2018 Senior Principal @ Senior Principal Packaging Technology at Oracle
2010 -
2015 Principal Packaging Technology R and D @
2000 -
2010 Sr. Manager of Package Development @
1998 -
2000 Staff Packaging Engineer @
1986 -
1998 Assembly Processing Development @ Amkor Korea
MJ Lee Skills
Failure Analysis
Semiconductors
Design of Experiments
FPGA
Cross-functional Team Leadership
Engineering Management
IC
PCB design
Debugging
Verilog
Hardware Architecture
Product Development
Assembly Processes
CMOS
FMEA
Analog
SoC
SPC
Electronics
ASIC
Microelectronics
Silicon
Manufacturing
Engineering
R&D
Consumer Electronics
Test Engineering
Product Engineering
Yield
Simulations
EDA
Mixed Signal
Embedded Systems
Semiconductor Industry
Packaging
RTL design
Reliability
Flash Memory
Process Integration
DFT
Integrated Circuits (IC)
Cross Functional Team Leadership
Program Management
Field Programmable Gate Arrays Fpga
Testing
Business Analysis
Integrated Circuits Ic
Hospitals
Cross Functional Team
Java
MJ Lee Summary
MJ Lee, based in San Jose, CA, US, is currently a EVP - Tech Advisor and Business Development at Daeduck Electronics - USA. MJ Lee brings experience from previous roles at Intel Corporation, Barefoot Networks and Senior Principal Packaging Technology at Oracle. With a robust skill set that includes Failure Analysis, Semiconductors, Design of Experiments, FPGA, Cross-functional Team Leadership and more. MJ Lee has 1 emails on RocketReach.
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