Ming-Che Hsieh Location

Hsinchu, TW

Ming-Che Hsieh Work

Ming-Che Hsieh Education

  • National Cheng Kung University

    Doctor of Philosophy (PhD) (Aeronautical and Astronautical Engineering)

    2000 - 2005

Ming-Che Hsieh Skills

  • Stress Analysis
  • Assembly Processes
  • Characterization
  • Microsoft Word
  • 3d Ic Integration
  • 3d Packaging
  • Wlcsp
  • Reliability Engineering
  • Semiconductor Failure Analysis
  • R&d

Ming-Che Hsieh Summary

Ming-Che Hsieh, based in Hsinchu, TW, is currently a FAE Director at STATS ChipPAC. Ming-Che Hsieh brings experience from previous roles at JCET Group Co., Ltd., STATS ChipPAC Ltd. and STATS ChipPAC. Ming-Che Hsieh holds a 2000 - 2005 Doctor of Philosophy (PhD) in Aeronautical and Astronautical Engineering @ National Cheng Kung University. With a robust skill set that includes Stress Analysis, Assembly Processes, Characterization, Microsoft Word, 3d Ic Integration and more.

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