2013 -2019 Senior Wafer Bond, Grind, Si CMP, Edge Trim @
1999 -2013 Sr. Wafer Thinning Engineer @
1989 -1999 Sr. Wire Bond Engineer @
Mike Ball Education
Boise State University
(Electronics Technology)
1983-1986
Mike Ball Skills
DRAM
Semiconductors
Electronics
CMOS
Semiconductor Industry
Testing
Continuous Improvement
Design of Experiments
JMP
Materials
Engineering
Product Engineering
Silicon
Failure Analysis
IC
Mike Ball Summary
Mike Ball, based in Coeur d'Alene, ID, US, is currently a Lead Reliability Engineer at Schweitzer Engineering Laboratories (SEL). Mike Ball brings experience from previous roles at Schweitzer Engineering Laboratories (SEL) and Micron Technology. Mike Ball holds a 1983 - 1986 Boise State University. With a robust skill set that includes DRAM, Semiconductors, Electronics, CMOS, Semiconductor Industry and more. Mike Ball has 1 emails on RocketReach.
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