Michael Baro Email
Head of Program | NLX Advanced Packaging @ ZEISS Semiconductor Manufacturing Technology
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Michael Baro Location
- Oberkochen, BW, DE
Michael Baro Work
- Head of Program | NLX Advanced Packaging @ (May 2026 - Present)
- Head of Product Management | Power System ICs @ (June 2023 - April 2026)
- Head of Product Management | Power and Isolation ICs @ (September 2021 - June 2023)
- Rising Stars Program @ (January 2021 - January 2022)
- Divisional Strategy, M and A and Business Development @ (July 2017 - August 2021)
- Private Equity Working Student @ (June 2016 - July 2016)
- Private Equity Investment Team Intern @ (September 2015 - October 2015)
- Private Equity Lifecycle Management Intern and Working Student @ (January 2014 - April 2015)
- Strategic Business Development Intern @ (March 2013 - June 2013)
- Investment Banking (M and A) Intern @ (October 2012 - December 2012)
- Financial Risk Management Intern @ (June 2011 - August 2011)
- Intern - Financial consulting for private clients @ (July 2010 - September 2010)
Michael Baro Education
- Technical University of Munich
Master of Science (M.Sc.) (Industrial Engineering)
2014-2016 - University of Mannheim
Bachelor of Science (Betriebswirtschaftslehre / Business Administration)
2009-2012 - HEC Montréal
(Betriebswirtschaftslehre / Business Administration)
2011-2011 - Dietrich-Bonhoeffer-Gymnasium
Abitur
2001-2009
Michael Baro Summary
- Michael Baro, based in Oberkochen, BW, DE, is currently a Head of Program | NLX Advanced Packaging at ZEISS Semiconductor Manufacturing Technology. Michael Baro brings experience from previous roles at Infineon Technologies. Michael Baro holds a 2014 - 2016 Master of Science (M.Sc.) in Industrial Engineering @ Technical University of Munich. Michael Baro has 3 emails on RocketReach.
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