Max Hsiao Email
資深部門經理 @ Chipbond Technology Corporation.
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Max Hsiao Location
- Taoyuan City, Taiwan, Taiwan
Max Hsiao Work
- 2020 -now 資深部門經理 @
- 2018 -2020 Program Manager @
- 2011 -2018 Manager @
- 2005 -2011 Senior Engineer @
Max Hsiao Education
- National Kaohsiung University of Applied Sciences
Bachelor's degree (Electrical and Electronics Engineering)
2000-2005
Max Hsiao Skills
- VB.NET
- PLC Programming
- CoDeSys
- Java
- Microsoft Office
- HMI Programming
- C++
- Mitsubishi PLC
- OMRON PLC
- MySQL
- Omron
- Programming
- PLC
- Debugging
- Automation
- Product Development
Max Hsiao Summary
- Max Hsiao, based in Taoyuan City, Taiwan, Taiwan, is currently a 資深部門經理 at 頎邦科技 CHIPBOND. Max Hsiao brings experience from previous roles at 頎邦科技 CHIPBOND, Manz Automation AG and AUO. Max Hsiao holds a 2000 - 2005 Bachelor's degree in Electrical and Electronics Engineering @ National Kaohsiung University of Applied Sciences. With a robust skill set that includes VB.NET, PLC Programming, CoDeSys, Java, Microsoft Office and more. Max Hsiao has 2 emails on RocketReach.
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