Max Hsiao Email

資深部門經理 @ Chipbond Technology Corporation.

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Max Hsiao Location

Taoyuan City, Taiwan, Taiwan

Max Hsiao Work

2020 - now 資深部門經理 @ Chipbond Technology Corporation.
2018 - 2020 Program Manager @ Chipbond Technology Corporation.
2011 - 2018 Manager @ Manz Asia

2005 - 2011 Senior Engineer @ AUO
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Max Hsiao Education

National Kaohsiung University of Applied Sciences
Bachelor's degree (Electrical and Electronics Engineering)
2000 - 2005

Max Hsiao Skills

VB.NET
PLC Programming
CoDeSys

Java
Microsoft Office
HMI Programming
C++
Mitsubishi PLC
OMRON PLC
MySQL

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Max Hsiao Summary

Max Hsiao, based in Taoyuan City, Taiwan, Taiwan, is currently a 資深部門經理 at 頎邦科技 CHIPBOND. Max Hsiao brings experience from previous roles at 頎邦科技 CHIPBOND, Manz Automation AG and AUO. Max Hsiao holds a 2000 - 2005 Bachelor's degree in Electrical and Electronics Engineering @ National Kaohsiung University of Applied Sciences. With a robust skill set that includes VB.NET, PLC Programming, CoDeSys, Java, Microsoft Office and more. Max Hsiao has 2 emails on RocketReach.

Max Hsiao Emails

Found 2 emails

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Max Hsiao

資深部門經理 at Chipbond Technology Corporation.

Taoyuan City, Taiwan, Taiwan
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- gmail.com

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