Brian Wu's Location
Kaohsiung City, Kaohsiung, Taiwan
Brian Wu's Work
- Hukou Operation Center, Vice President @ Chipbond Technology Corporation.
- R and D Center, Assistant VP @ Chipbond Technology Corporation.
- Bumping Engineering Sr. Director @ Advance Semiconductor Engineering (ASE)
- QA Sr. Director @ Advance Semiconductor Engineering (ASE)
- Bumping Engineering Sr. Director @ Advance Semiconductor Engineering (ASE)
- Etch process engineer @ Mosel
Brian Wu's Education
- Syracuse University
Master (Manufacturing Engineering)
- National Cheng Kung University
Bachelor's degree (Mechanical Engineering)
Brian Wu's Skills
- Microsoft Office
- Business Analysis
- Process Engineering
- Process Improvement
- Engineering
- SQL
- Microsoft Excel
- Software Development
- Testing
- Clinical Development
Brian Wu's Summary
Brian Wu, based in Kaohsiung City, Kaohsiung, Taiwan, is currently a Hukou Operation Center, Vice President at 頎邦科技 CHIPBOND, bringing experience from previous roles at 頎邦科技 CHIPBOND, Advance Semiconductor Engineering (ASE) and ASE(Advanced Semiconductor Engineering). Brian Wu holds a Master in Manufacturing Engineering @ Syracuse University. With a robust skill set that includes Microsoft Office, Business Analysis, Process Engineering, Process Improvement, Engineering and more, Brian Wu contributes valuable insights to the industry. Brian Wu has 3 emails on RocketReach.
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35+
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Brian Wu
Hukou Operation Center, Vice President at Chipbond Technology Corporation.
Kaohsiung City, Kaohsiung, Taiwan3 -
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Technical Support Analyst at Chipbond Technology Corporation.
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