Brian Wu Email
Hukou Operation Center, Vice President @ Chipbond Technology Corporation.
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Brian Wu Location
- Kaohsiung City, Taiwan
Brian Wu Work
- now Hukou Operation Center, Vice President @
- now R and D Center, Assistant VP @
- now Bumping Engineering Sr. Director @
- now QA Sr. Director @
- now Bumping Engineering Sr. Director @
- now Etch process engineer @
Brian Wu Education
- Syracuse University 1995-1997
- National Cheng Kung University 1986-1990
Brian Wu Skills
- Microsoft Office
- Business Analysis
- Process Engineering
- Process Improvement
- Engineering
- SQL
- Microsoft Excel
- Software Development
- Testing
- Clinical Development
- HAZOP
- Solidworks
- Kaizen
- Factory
- Semiconductors
- MEMS
- Electronics
- Semiconductor Industry
- SPC
- Design of Experiments
- JMP
- Failure Analysis
- IC
Brian Wu Summary
- Brian Wu, based in Kaohsiung City, Taiwan, is currently a Hukou Operation Center, Vice President at 頎邦科技 CHIPBOND. Brian Wu brings experience from previous roles at 頎邦科技 CHIPBOND, Advance Semiconductor Engineering (ASE) and ASE(Advanced Semiconductor Engineering). Brian Wu holds a 1995 - 1997 Syracuse University. With a robust skill set that includes Microsoft Office, Business Analysis, Process Engineering, Process Improvement, Engineering and more. Brian Wu has 3 emails on RocketReach.
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