Brian Wu Email
R and D center, Vice President @ Chipbond Technology Corporation.
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Brian Wu Location
- Kaohsiung City, Taiwan
Brian Wu Work
- R and D center, Vice President @ (July 2025 - Present)
- President Office, Vice President @ (May 2024 - June 2025)
- Hukou Operation Center, Vice President @ (July 2021 - April 2024)
- R and D Center, Assistant VP @ (August 2020 - June 2021)
- Bumping Engineering Sr. Director @ (December 2016 - July 2020)
- QA Sr. Director @ (March 2013 - November 2016)
- Bumping Engineering Sr. Director @ ASE(Advanced Semiconductor Engineering) (November 2005 - February 2013)
- Etch process engineer @ Mosel (January 1998 - May 1999)
Brian Wu Education
- Syracuse University
Master (Manufacturing Engineering)
1995-1997 - National Cheng Kung University
Bachelor's degree (Mechanical Engineering)
1986-1990
Brian Wu Skills
- Microsoft Office
- Business Analysis
- Process Engineering
- Process Improvement
- Engineering
- SQL
- Microsoft Excel
- Software Development
- Testing
- Clinical Development
- HAZOP
- Solidworks
- Kaizen
- Factory
- Semiconductors
- MEMS
- Electronics
- Semiconductor Industry
- SPC
- Design of Experiments
- JMP
- Failure Analysis
- IC
Brian Wu Summary
- Brian Wu, based in Kaohsiung City, Taiwan, is currently a R and D center, Vice President at 頎邦科技 CHIPBOND. Brian Wu brings experience from previous roles at 頎邦科技 CHIPBOND and Advance Semiconductor Engineering (ASE). Brian Wu holds a 1995 - 1997 Master in Manufacturing Engineering @ Syracuse University. With a robust skill set that includes Microsoft Office, Business Analysis, Process Engineering, Process Improvement, Engineering and more. Brian Wu has 2 emails on RocketReach.
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Kaohsiung City, Taiwan
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Taipei City, Taiwan, Taiwan
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Hsinchu, TW
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