Brian Wu Email
Hukou Operation Center, Vice President @ Chipbond Technology Corporation.
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Brian Wu Location
- Kaohsiung City, Taiwan
Brian Wu Work
- now Hukou Operation Center, Vice President @
- now R and D Center, Assistant VP @
- now Bumping Engineering Sr. Director @
- now QA Sr. Director @
- now Bumping Engineering Sr. Director @
- now Etch process engineer @
Brian Wu Education
- Syracuse University 1995 - 1997
- National Cheng Kung University 1986 - 1990
Brian Wu Skills
- Microsoft Office
- Business Analysis
- Process Engineering
- Process Improvement
- Engineering
- SQL
- Microsoft Excel
- Software Development
- Testing
- Clinical Development
- HAZOP
- Solidworks
- Kaizen
- Factory
- Semiconductors
- MEMS
- Electronics
- Semiconductor Industry
- SPC
- Design of Experiments
- JMP
- Failure Analysis
- IC
Brian Wu Summary
- Brian Wu, based in Kaohsiung City, Taiwan, is currently a Hukou Operation Center, Vice President at 頎邦科技 CHIPBOND. Brian Wu brings experience from previous roles at 頎邦科技 CHIPBOND, Advance Semiconductor Engineering (ASE) and ASE(Advanced Semiconductor Engineering). Brian Wu holds a 1995 - 1997 Syracuse University. With a robust skill set that includes Microsoft Office, Business Analysis, Process Engineering, Process Improvement, Engineering and more. Brian Wu has 3 emails on RocketReach.
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Top Chipbond Technology Corporation. Employees
Brian Wu
Hukou Operation Center, Vice President
Kaohsiung City, Taiwan
Roger Lo
Senior Chief Engineer
Taipei City, Taiwan, Taiwan
Eva Tsai
Foreign Employee Relation Dept. Manager
Hsinchu, TW
張瑜芳
Supervisor Engineer
Taiwan
艾倫
NPI Test Development Senior Principal Engineer
Hsinchu, Taiwan
Yuchung Huang
Senior Project Manager
Hsinchu, TW
澤漳 陳
主任工程師
Tainan, Tainan City, Taiwan
Evan Pei
Quality Engineering department manager
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信欽 黃
IE Project Manager
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Dan Huang
Senior Software Developer
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詩弼 洪
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