Brian Wu Email
R and D center, Vice President @ Chipbond Technology Corporation.
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Brian Wu Location
- Kaohsiung City, Taiwan
Brian Wu Work
- 2025 -now R and D center, Vice President @
- 2024 -2025 President Office, Vice President @
- 2021 -2024 Hukou Operation Center, Vice President @
- 2020 -2021 R and D Center, Assistant VP @
- 2016 -2020 Bumping Engineering Sr. Director @
- 2013 -2016 QA Sr. Director @
- 2005 -2013 Bumping Engineering Sr. Director @ ASE(Advanced Semiconductor Engineering)
- 1998 -1999 Etch process engineer @ Mosel
Brian Wu Education
- Syracuse University
Master (Manufacturing Engineering)
1995-1997 - National Cheng Kung University
Bachelor's degree (Mechanical Engineering)
1986-1990
Brian Wu Skills
- Microsoft Office
- Business Analysis
- Process Engineering
- Process Improvement
- Engineering
- SQL
- Microsoft Excel
- Software Development
- Testing
- Clinical Development
- HAZOP
- Solidworks
- Kaizen
- Factory
- Semiconductors
- MEMS
- Electronics
- Semiconductor Industry
- SPC
- Design of Experiments
- JMP
- Failure Analysis
- IC
Brian Wu Summary
- Brian Wu, based in Kaohsiung City, Taiwan, is currently a R and D center, Vice President at 頎邦科技 CHIPBOND. Brian Wu brings experience from previous roles at 頎邦科技 CHIPBOND and Advance Semiconductor Engineering (ASE). Brian Wu holds a 1995 - 1997 Master in Manufacturing Engineering @ Syracuse University. With a robust skill set that includes Microsoft Office, Business Analysis, Process Engineering, Process Improvement, Engineering and more. Brian Wu has 2 emails on RocketReach.
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