Packaging Manager, Technology Development @ (April 2013 - December 2016)
Principal Packaging Engineer @ (July 2011 - April 2013)
Senior MEMS Engineer @ (June 2010 - July 2011)
Staff MEMS Packaging Engineer @ (October 2006 - June 2010)
Research Associate @ (July 2005 - October 2006)
Li Sun Education
University of Arkansas at Fayetteville
Ph.D. (Mechanical Engineering)
2001-2005
Tsinghua University
M.E. (Materials Processing Engineering)
1999-2001
Tsinghua University
B.E. (Mechanical Engineering)
1995-1999
Li Sun Skills
MEMS
AutoCAD
Design of Experiments
Failure Analysis
Thin Films
Matlab
JMP
ANSYS
Finite Element Analysis
R&D
Characterization
RF
Manufacturing
IC
Silicon
Development
Packaging
Technology
Microsoft Office
Entrepreneurship
Research
Li Sun Summary
Li Sun, based in San Jose, CA, US, is currently a Senior Manager, Packaging Solutions at Broadcom Inc.. Li Sun brings experience from previous roles at Broadcom Inc., Qualcomm and Wispry. Li Sun holds a 2001 - 2005 Ph.D. in Mechanical Engineering @ University of Arkansas at Fayetteville. With a robust skill set that includes MEMS, AutoCAD, Design of Experiments, Failure Analysis, Thin Films and more. Li Sun has 3 emails and 3 mobile phone numbers on RocketReach.
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