Li Sun Location
- San Jose, CA, US
Li Sun Work
- 2016 - now Senior Manager, Packaging Solutions @
- 2013 - 2016 Packaging Manager, Technology Development @
- 2011 - 2013 Principal Packaging Engineer @
- 2010 - 2011 Senior MEMS Engineer @
- 2006 - 2010 Staff MEMS Packaging Engineer @
- 2005 - 2006 Research Associate @
Li Sun Education
- University of Arkansas at Fayetteville
Ph.D. (Mechanical Engineering)
2001 - 2005 - Tsinghua University
M.E. (Materials Processing Engineering)
1999 - 2001 - Tsinghua University
B.E. (Mechanical Engineering)
1995 - 1999
Li Sun Skills
- MEMS
- AutoCAD
- Design of Experiments
- Failure Analysis
- Thin Films
- Matlab
- JMP
- ANSYS
- Finite Element Analysis
- R&D
- Characterization
- RF
- Manufacturing
- IC
- Silicon
- Development
- Packaging
- Technology
- Microsoft Office
- Entrepreneurship
- Research
Li Sun Summary
- Li Sun, based in San Jose, CA, US, is currently a Senior Manager, Packaging Solutions at Broadcom Inc.. Li Sun brings experience from previous roles at Broadcom Inc., Qualcomm and Wispry. Li Sun holds a 2001 - 2005 Ph.D. in Mechanical Engineering @ University of Arkansas at Fayetteville. With a robust skill set that includes MEMS, AutoCAD, Design of Experiments, Failure Analysis, Thin Films and more. Li Sun has 2 emails and 2 mobile phone numbers on RocketReach.
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