Lei Lin, based in Aurora, ON, CA, is currently a Senior Printed Circuit Board Designer at AMD, bringing experience from previous roles at Murata Power Solutions, WOMATE TECHNOLOGIES CO., LTD, Huawei Technologies and Dbtel Technologies Co., Ltd. Lei Lin holds a 2021 - 2021 Advanced Certified Interconnect Designer @ IPC. With a robust skill set that includes PCB design, Flex Circuits, Signal Integrity, Power Integrity, High Density Interconnection and more, Lei Lin contributes valuable insights to the industry. Lei Lin has 3 emails and 1 mobile phone number on RocketReach.