Kong Lee Email & Phone Number
Senior Principal Packaging Technical Lead @ Lumentum
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Kong Lee Location
- San Jose, CA, US
Kong Lee Work
- Senior Principal Packaging Technical Lead @ (February 2010 - Present)
- Senior Staff Packaging Engineer @ (April 2008 - March 2010)
- Packaging Engineering Manager @ (January 2005 - April 2008)
- Expert Engineer @ (January 2002 - December 2004)
- Process Development Engineer @ (April 1997 - October 1998)
- Process Development Engineer @ (April 1993 - January 1997)
Kong Lee Education
- University of Cambridge
Ph.D. (Materials Science and Metallurgy)
- University Science of Malaysia
Bachelor of Applied Science (B.A.Sc.) (Master of Science (Msc.))
- University Science of Malaysia
Kong Lee Skills
- 3D sensing package
- 8D Problem Solving
- AuSn Soldering
- Continuous Improvement
- Cross-functional Team Leadership
- Design of Experiments
- Electronics Packaging
- Engineering
- Engineering Management
- Eutectic and Epoxy Die Bonding
- FMEA
- Failure Analysis
- Flip Chip
- Gesture Recognition
- Gold and Aluminum Wire Bonding
- Heavy Wire Bonding
- High Power Laser Packaging
- IC
- IC packaging
- JMP
- LED Packaging
- Lean Manufacturing
- Lean Six Sigma
- Manufacturing
- Materials
- Materials Science
- Microelectronics
- Minitab
- Package and Process Development
- Photonics
- Process Simulation
- Product Development
- Project Management
- Project Planning
- R&D
- RF
- RF Packaging
- Reliability
- SPC
- Semiconductor Industry
- Semiconductors
- Silicon Photonics
- Six Sigma
- SoC
- SolidWorks
- TO-can Packaging
- Wire Bonding
- Yield
- ceramic packaging
- wafer level packaging
- To Can Packaging
- Sales
- Program Management
- Software Development
- Management
- JavaScript
- Integration
- Microsoft Office
- Cross Functional Team Leadership
Kong Lee Summary
- Kong Lee, based in San Jose, CA, US, is currently a Senior Principal Packaging Technical Lead at Lumentum. Kong Lee brings experience from previous roles at Xilinx, Infineon Technologies, Agilent Technologies and Intel. Kong Lee holds a Ph.D. in Materials Science and Metallurgy @ University of Cambridge. With a robust skill set that includes 3D sensing package, 8D Problem Solving, AuSn Soldering, Continuous Improvement, Cross-functional Team Leadership and more. Kong Lee has 3 emails and 7 mobile phone numbers on RocketReach.
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