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Keith Tan Location
Singapore
Keith Tan Work
2014 -now Director, Assembly and Packaging Engineering @
2006 -2014 Manager, Ic Packaging @
1998 -2004 Engineer @ Microfab Technology Pte
1997 -1998 Engineer @
Keith Tan Education
National University of Singapore
(Engineering)
1993-1997
Keith Tan Summary
Keith Tan, based in Singapore, is currently a Director, Assembly and Packaging Engineering at Broadcom. Keith Tan brings experience from previous roles at Broadcom, Microfab Technology Pte and Hewlett Packard Enterprise. Keith Tan holds a 1993 - 1997 National University of Singapore. Keith Tan has 3 emails and 1 mobile phone numbers on RocketReach.
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