If you need more lookups,
subscriptions start at $34 USD/month.
Keith Tan Location
Singapore
Keith Tan Work
Director, Assembly and Packaging Engineering @ (March 2014 - Present)
Manager, Ic Packaging @ (June 2006 - March 2014)
Engineer @ Microfab Technology Pte (January 1998 - January 2004)
Engineer @ (January 1997 - January 1998)
Keith Tan Education
National University of Singapore
(Engineering)
1993-1997
Keith Tan Summary
Keith Tan, based in Singapore, is currently a Director, Assembly and Packaging Engineering at Broadcom. Keith Tan brings experience from previous roles at Broadcom, Microfab Technology Pte and Hewlett Packard Enterprise. Keith Tan holds a 1993 - 1997 National University of Singapore. Keith Tan has 3 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Keith Tan?
Find contact details for 700 million professionals.