2013 -2014 Manger of Poduct Technology Marketing Business Development @
2012 -2013 Sr. Package Engineer @
2006 -2012 Technical Program Manager @
2005 -2006 Quality and Electrical Engineer @
Johnny Kuo Education
The University of Texas at Arlington 2002-2004
Johnny Kuo Summary
Johnny Kuo, based in Tempe, AZ, US, is currently a Director of Wirebond BGA Product at Amkor Technology, Inc.. Johnny Kuo brings experience from previous roles at Amkor Technology, Inc., STATS ChipPAC, Everspin Technologies and Siliconware Precision Industries. Johnny Kuo holds a 2002 - 2004 The University of Texas at Arlington. Johnny Kuo has 2 emails and 3 mobile phone numbers on RocketReach.
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