Johnny Kuo Email & Phone Number
Director of Wirebond BGA Product @ Amkor Technology, Inc.
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Johnny Kuo Location
- Tempe, AZ, US
Johnny Kuo Work
- Director of Wirebond BGA Product @ (July 2021 - Present)
- Sr. Manger Dual Leadframe Product @ (December 2014 - June 2021)
- Manger of Poduct Technology Marketing Business Development @ (May 2013 - November 2014)
- Sr. Package Engineer @ (June 2012 - May 2013)
- Technical Program Manager @ (June 2006 - May 2012)
- Quality and Electrical Engineer @ (February 2005 - June 2006)
Johnny Kuo Education
- The University of Texas at Arlington 2002-2004
Johnny Kuo Summary
- Johnny Kuo, based in Tempe, AZ, US, is currently a Director of Wirebond BGA Product at Amkor Technology, Inc.. Johnny Kuo brings experience from previous roles at Amkor Technology, Inc., STATS ChipPAC, Everspin Technologies and Siliconware Precision Industries. Johnny Kuo holds a 2002 - 2004 The University of Texas at Arlington. Johnny Kuo has 5 emails and 3 mobile phone numbers on RocketReach.
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