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Jin Chen Location
Sunnyvale, CA, US
Jin Chen Work
Senior IC Package Design Engineer @ (November 2024 - Present)
IC Package Design Engineer @ (April 2022 - December 2024)
Semiconductor Packaging Engineer @ (June 2021 - March 2022)
IC Packaging Engineering Intern @ (June 2020 - August 2020)
Product Packaging Engineering Intern @ (May 2019 - April 2020)
Facilities Mechanical Engineering Intern @ (May 2018 - August 2018)
Jin Chen Education
The University of Texas at Dallas
Master of Science - MS (Mechanical Engineering)
2019-2021
The University of Texas at Dallas
Bachelor of Science - BS (Mechanical Engineering)
2016-2020
Jin Chen Skills
APD/SiP
Allegro Package Designer
Co-design
IC Substrate Design
Leadership
Multi-source manufaturing
Project Management
SolidWorks
Supplier Engagement
Teamwork
Jin Chen Summary
Jin Chen, based in Sunnyvale, CA, US, is currently a Senior IC Package Design Engineer at Broadcom. Jin Chen brings experience from previous roles at Broadcom, Texas Instruments and Qorvo, Inc.. Jin Chen holds a 2019 - 2021 Master of Science - MS in Mechanical Engineering @ The University of Texas at Dallas. With a robust skill set that includes APD/SiP, Allegro Package Designer, Co-design, IC Substrate Design, Leadership and more. Jin Chen has 3 emails and 2 mobile phone numbers on RocketReach.
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