Jiaqi Deng's Location
Shanghai, Shanghai, China
Jiaqi Deng's Work
- Technical process develop engineer @ Solidigm
- Technical Process Develop Engineer @ Intel Corporation
- Senior Mechanical Engineer @ Intel Corporation
- Engineer Mechanical @ Wind Communication Technologies Co. Ltd, SH
- Staff Mechanical Engineer @ TCL&Alcatel Mobile Phone R&D Center,Shanghai,China
Jiaqi Deng's Education
- Harbin University of Science and Technology
Bachelor's degree (Electrical and Electronics Engineering)
2003 - 2007
Jiaqi Deng's Skills
- Finite Element Analysis
- Engineering
- Solidworks
- Pumps
Jiaqi Deng's Summary
Jiaqi Deng, based in Shanghai, Shanghai, China, is currently a Technical process develop engineer at Solidigm, bringing experience from previous roles at 英特尔, Intel Corporation, Wind Communication Technologies Co. Ltd, SH and TCL&Alcatel Mobile Phone R&D Center,Shanghai,China. Jiaqi Deng holds a 2003 - 2007 Bachelor's degree in Electrical and Electronics Engineering @ Harbin University of Science and Technology. With a robust skill set that includes Finite Element Analysis, Engineering, Solidworks, Pumps and more, Jiaqi Deng contributes valuable insights to the industry. Jiaqi Deng has 1 email on RocketReach.
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