2008 -
now Firmware Leading Engineer of RD Department @
2004 -
2008 CIM Engineer @ ProMos Technology
2002 -
2004 System Analyst @ Kang Da Information
Jay Tsai Education
University of Detroit Mercy
Master's degree (Computer and Information System)
2000
-
2002
明新工業專科學校
Jay Tsai Skills
Batteries
Firmware
Laptops
Embedded Software
Design for Manufacturing
Embedded Systems
Debugging
Electrical Engineering
Microcontrollers
Verilog
VHDL
Jay Tsai Summary
Jay Tsai, based in Taiwan, is currently a Firmware Leading Engineer of RD Department at Dynapack Technology. Jay Tsai brings experience from previous roles at ProMos Technology and Kang Da Information. Jay Tsai holds a 2000 - 2002 Master's degree in Computer and Information System @ University of Detroit Mercy. With a robust skill set that includes Batteries, Firmware, Laptops, Embedded Software, Design for Manufacturing and more. Jay Tsai has 2 emails on RocketReach.
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