Jay Tsai Email
Firmware Leading Engineer of RD Department @ Dynapack Technology
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Jay Tsai Location
- Taiwan
Jay Tsai Work
- 2008 -now Firmware Leading Engineer of RD Department @
- 2004 -2008 CIM Engineer @ ProMos Technology
- 2002 -2004 System Analyst @ Kang Da Information
Jay Tsai Education
- University of Detroit Mercy
Master's degree (Computer and Information System)
2000-2002 - 明新工業專科學校
Jay Tsai Skills
- Batteries
- Firmware
- Laptops
- Embedded Software
- Design for Manufacturing
- Embedded Systems
- Debugging
- Electrical Engineering
- Microcontrollers
- Verilog
- VHDL
Jay Tsai Summary
- Jay Tsai, based in Taiwan, is currently a Firmware Leading Engineer of RD Department at Dynapack Technology. Jay Tsai brings experience from previous roles at ProMos Technology and Kang Da Information. Jay Tsai holds a 2000 - 2002 Master's degree in Computer and Information System @ University of Detroit Mercy. With a robust skill set that includes Batteries, Firmware, Laptops, Embedded Software, Design for Manufacturing and more. Jay Tsai has 2 emails on RocketReach.
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