Hong Yang Email & Phone Number
ASIC Packaging Manager @ Amazon
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Hong Yang Location
- San Diego, CA, US
Hong Yang Work
- ASIC Packaging Manager @ (August 2024 - Present)
- Senior IC Packaging Engineer @ (April 2022 - Present)
- Senior Principal Packaging Engineer @ (September 2016 - April 2022)
- Principal Quality Assurance Engineer @ (May 2015 - August 2016)
- Manager and Sr. Staff Engineer, Quality Reliability Engineering @ (April 2008 - May 2015)
- Principle Reliability Engineer @ (March 2000 - April 2008)
- Reliability Engineer @ (January 1996 - March 2000)
Hong Yang Education
- University of California, San Diego
Leadership and Management Program (LAMP)
2013 - North Carolina State University
Ph.D. (Materials Science and Engineering)
1992-1996 - North Carolina State University
M.S. (Nuclear Engineering)
1989-1993 - Tsinghua University
B.Eng (Engineering Physics)
1980-1985
Hong Yang Skills
- Semiconductors
- IC
- Semiconductor Industry
- Reliability
- Electronics
- Cross-functional Team Leadership
- Manufacturing
- Cross Functional Team Leadership
Hong Yang Summary
- Hong Yang, based in San Diego, CA, US, is currently a ASIC Packaging Manager at Amazon Project Kuiper. Hong Yang brings experience from previous roles at Amazon Project Kuiper, MaxLinear and Entropic Communications. Hong Yang holds a Leadership and Management Program (LAMP) @ University of California, San Diego. With a robust skill set that includes Semiconductors, IC, Semiconductor Industry, Reliability, Electronics and more. Hong Yang has 1 emails and 2 mobile phone numbers on RocketReach.
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