Hong Yang, based in San Diego, CA, US, is currently a ASIC Packaging Manager at Amazon Project Kuiper. Hong Yang brings experience from previous roles at Amazon Project Kuiper, MaxLinear and Entropic Communications. Hong Yang holds a Leadership and Management Program (LAMP) @ University of California, San Diego. With a robust skill set that includes Semiconductors, IC, Semiconductor Industry, Reliability, Electronics and more. Hong Yang has 1 emails and 2 mobile phone numbers on RocketReach.
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