1984 -1986 Packaging Engineer @ Narda Western Operations
1981 -1984 Mechanical Engineer @
Greg Valenti Education
Syracuse University
Bachelor of Science (BS) (Mechanical Engineering)
1977-1981
Greg Valenti Skills
IC packaging
RF/microwave semiconductor packaging
Organic substrate multichip modules
Backend wafer processing
Wafer bumping
Chip scale packaging
Organic substrate multichip module
Die thermal modelling
PCB physical design
PCB floorplanning
PCB Connector selection
PCB EMI shielding design
PCB thermal modelling
Module design
Enclosure design
Backplane design
Enclosure thermal design and modelling
Enclosure EMI shielding design
Hot swap design
Cable Management
Tolerance Analysis
Sheet Metal
Stamping
Progressive tooled stamping and forming
Precision machining
Sand, investment, die casting
3D printing and rapid prototyping
Injection molded plastics
Ceramics and associated metallization
Plating and metal finishing
FEA – ANSYS, Cosmos, Algor
Flotherm
Solidworks
Agilent ADS
Structural, vibration, shock, modelling
Thermal modelling
IR scanning
Geometric dimensioning and tolerancing
Sand
Die Casting
Modelling
COSMOS
Structural
Vibration
Investment
Shock
Fea Ansys
Algor
Greg Valenti Summary
Greg Valenti, based in Richardson, TX, US, is currently a Sr. Mgr. Mechanical Engineering at Qorvo, Inc.. Greg Valenti brings experience from previous roles at RFMD, Onix Microsystems, IOSpan Wireless and Lucent Technologies. Greg Valenti holds a 1977 - 1981 Bachelor of Science (BS) in Mechanical Engineering @ Syracuse University. With a robust skill set that includes IC packaging, RF/microwave semiconductor packaging, Organic substrate multichip modules, Backend wafer processing, Wafer bumping and more. Greg Valenti has 1 emails and 2 mobile phone numbers on RocketReach.
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