Gordon Chong Email & Phone Number
Hardware Engineer - Process Development and SIP Assembly Engineer @ Broadcom
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Gordon Chong Location
- South San Francisco, CA, US
Gordon Chong Work
- Hardware Engineer - Process Development and SIP Assembly Engineer @ (October 2024 - Present)
- Process Development Engineer @ (August 2021 - November 2023)
Gordon Chong Education
- University of California, Davis
Bachelor of Science - BS (Mechanical Engineering)
2018-2020 - College of San Mateo
ENGINEERING
2016-2018 - Skyline College
ENGINEERING
2016-2018 - Burton (Phillip and Sala) Academic High School 2011
Gordon Chong Skills
- 3D Printing
- Arduino
- AutoCAD
- Autodesk Fusion 360
- Communication
- Computer-Aided Design (CAD)
- Creative Problem Solving
- Customer Service
- Design Analysis
- Electric Motors
- Electrical Wiring
- Engineering
- Equipment Programing
- Laser Cutting
- Laser Engraving
- MATLAB
- Mechanical Engineering
- Microsoft Excel
- Microsoft Office
- Oral Communication
- Packaging Design
- Presentations
- Problem Solving
- Process Operations
- Project Management
- SIP Assembly and Troubleshooting
- SOLIDWORKS
- Semiconductor Engineering
- Semiconductor Industry
- Semiconductor Process
- Soldering
- Strategy
- Troubleshooting
Gordon Chong Summary
- Gordon Chong, based in South San Francisco, CA, US, is currently a Hardware Engineer - Process Development and SIP Assembly Engineer at Broadcom. Gordon Chong brings experience from previous roles at Wolfspeed. Gordon Chong holds a 2018 - 2020 Bachelor of Science - BS in Mechanical Engineering @ University of California, Davis. With a robust skill set that includes 3D Printing, Arduino, AutoCAD, Autodesk Fusion 360, Communication and more. Gordon Chong has 2 emails and 3 mobile phone numbers on RocketReach.
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