Gerald Adriano's Location
Temecula, CA, US
Gerald Adriano's Work
- Principal Assembly Packaging Engineer @ Silanna Semiconductor
- Senior Staff Assembly Packaging Engineer @ Infineon Technologies
- Staff Assembly Packaging Engineer @ International Rectifier an Infineon Technologies Company
- Technical Program Manager @ STATS ChipPAC Ltd.
- Assistant Manager Package and Process Development @ International Rectifier an Infineon Technologies Company
- Senior Package and Process Development Engineer @ Amkor Technology, Inc.
Gerald Adriano's Education
- Mapúa University
Bachelor of Science (Electrical Engineering)
1993 - 1998
Gerald Adriano's Skills
- Six Sigma
- Packaging
- Engineering Management
- Cross Functional Team
- Root Cause Analysis
- Assembly Language
- Analog
- FMEA
- Process Improvement
- JMP
Gerald Adriano's Summary
Gerald Adriano, based in Temecula, CA, US, is currently a Principal Assembly Packaging Engineer at Silanna, bringing experience from previous roles at Infineon Technologies, International Rectifier an Infineon Technologies Company and Stats Chippac Ltd.. Gerald Adriano holds a 1993 - 1998 Bachelor of Science in Electrical Engineering @ Mapúa University. With a robust skill set that includes Six Sigma, Packaging, Engineering Management, Cross Functional Team, Root Cause Analysis and more, Gerald Adriano contributes valuable insights to the industry. Gerald Adriano has 1 email on RocketReach.
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