Fan Yeung Email & Phone Number
Packaging and PCB Lead @ NUVACORE
5 free lookup(s).
If you need more lookups,
subscriptions start at $34 USD/month.
Fan Yeung Location
- Santa Clara, CA, US
Fan Yeung Work
- Packaging and PCB Lead @ (April 2026 - Present)
- Sr Director - Engineering @ (December 2021 - April 2026)
- Director - Engineering @ (March 2021 - November 2021)
- IC Packaging Lead - Design and Technology @ (May 2019 - March 2021)
- IC Package Engineer @ (December 2015 - May 2019)
- Associate Technical Director - IC Package Engineering @ (March 2013 - November 2015)
- Senior Principal Engineer - IC Packaging Design and Development @ (March 2006 - February 2013)
- Senior Engineer - IC Packaging @ (August 1997 - March 2006)
- Account Manager @ (September 1994 - March 1997)
Fan Yeung Education
- 北大附中 The Affiliated High School of Peking University
- Tsinghua University
B.Eng (Material Science and Engineering)
- City University of Hong Kong
M.Phil (Electronic Engineering)
Fan Yeung Skills
- Semiconductors
- IC
- ASIC
- SoC
- Signal Integrity
- Silicon
- Failure Analysis
- Electronics Packaging
- Mixed Signal
- Semiconductor Industry
- Product Engineering
- VLSI
- CMOS
- Engineering
Fan Yeung Summary
- Fan Yeung, based in Santa Clara, CA, US, is currently a Packaging and PCB Lead at NUVACORE. Fan Yeung brings experience from previous roles at Qualcomm, NUVIA Inc and Apple. Fan Yeung holds a 北大附中 The Affiliated High School of Peking University. With a robust skill set that includes Semiconductors, IC, ASIC, SoC, Signal Integrity and more. Fan Yeung has 1 emails and 2 mobile phone numbers on RocketReach.
Looking for a different Fan Yeung?
Find contact details for 700 million professionals.
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co