2008 -2015 Senior IC Product Packaging Engineer and NPI Project Manager, Digital Networking Products @
2006 -2008 IC Product Packaging Engineer and NPI Project Manager, Wireless Products @
1998 -2006 IC Product Packaging Engineer and NPI Project Manager, Automotive Products @
1997 -1998 Engineering Rotational Program @
Eric Triplett Education
The University of Texas at Austin
Master of Science (MS) (Mechanical Engineering)
1994-1996
The University of Texas at Austin
Bachelor of Science (BS) (Mechanical Engineering)
1989-1994
Eric Triplett Skills
Packaging
QS9000
Cross Functional Team
System On A Chip Soc
Automotive Electronics
Reliability
Microprocessors
Wire Bonding
ASIC
Heat Transfer
Substrates
Engineering
Product Engineering
Thermal Analysis
8D Problem Solving
Integrated Circuits Ic
CMOS
Semiconductor Industry
Testing
Program Management
Cross Functional Team Leadership
Manufacturing
SoC
Design of Experiments
Failure Analysis
Semiconductors
Product Development
Project Management
Conference Proceedings
Process Engineering
ISO/TS 16949
Thermal System Design
Flip Chip
Aec
Board Level
Silicon
IC
System on a Chip
Integrated Circuits
Eric Triplett Summary
Eric Triplett, based in Austin, TX, US, is currently a Director Corporate Quality at Amkor Technology, Inc.. Eric Triplett brings experience from previous roles at Amkor Technology, Inc., Continental and Freescale Semiconductor. Eric Triplett holds a 1994 - 1996 Master of Science (MS) in Mechanical Engineering @ The University of Texas at Austin. With a robust skill set that includes Packaging, QS9000, Cross Functional Team, System On A Chip Soc, Automotive Electronics and more. Eric Triplett has 1 emails and 2 mobile phone numbers on RocketReach.
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