Dion T. Email
Principal Advanced Packaging Integration Engineer @ TSMC
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Dion T. Location
- Hsinchu, TW
Dion T. Work
- 2021 -now Principal Advanced Packaging Integration Engineer @
- 2019 -2021 Senior Module Integration Engineer @
- 2018 -2019 Senior Process Engineer @
- 2012 -2018 Research and Development Engineer @ Awin Diamond Technology Corporation
Dion T. Education
- National Chiao Tung University
Master of Science (M.S.) (Bioengineering)
2010-2012 - 國立交通大學
Bachelor of Science (BS) (Biotechnology)
2005-2010 - International Bilingual School at Hsinchu-Science-Park
Dion T. Summary
- Dion T., based in Hsinchu, TW, is currently a Principal Advanced Packaging Integration Engineer at TSMC. Dion T. brings experience from previous roles at TSMC and Awin Diamond Technology Corporation. Dion T. holds a 2010 - 2012 Master of Science (M.S.) in Bioengineering @ National Chiao Tung University. Dion T. has 1 emails on RocketReach.
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