Principal Engineer, Product Quality Engineering @ (February 2016 - November 2016)
Sr. Staff Engineer, Assembly Quality and Reliability @ (October 2011 - January 2016)
Technical Program Manager @ (September 2007 - September 2011)
Principal Engineer, Customer Engineering Integration @ (February 2006 - July 2007)
Principal Engineer, Flip Chip Package Development and NPI @ (January 2002 - January 2006)
Engineer, Flip Chip Process Engineering @ (June 2001 - December 2001)
Darren Ho Education
National Chung Hsing University
Master’s Degree
National Chung Hsing University
Bachelor’s Degree
Darren Ho Skills
IC Packaging
IC Assembly
Flip Chip
Semiconductors
Product Development
Design of Experiments
Semiconductor Industry
Failure Analysis
Manufacturing
FMEA
Engineering Management
Process Engineering
Silicon
Product Engineering
IC
Mixed Signal
Cross-functional Team Leadership
Integrated Circuits (IC)
Technology
Assembly Language
Reliability
Engineering
Integrated Circuits Ic
Cross Functional Team Leadership
Integrated Circuits
Darren Ho Summary
Darren Ho, based in Irvine, CA, US, is currently a Product Quality Engineer at Broadcom Inc.. Darren Ho brings experience from previous roles at Qualcomm, Broadcom Limited and ASE Group. Darren Ho holds a Master’s Degree @ National Chung Hsing University. With a robust skill set that includes IC Packaging, IC Assembly, Flip Chip, Semiconductors, Product Development and more. Darren Ho has 3 emails and 3 mobile phone numbers on RocketReach.
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