Daniel Lai Email & Phone Number
Sr TPM @ NVIDIA
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Daniel Lai Location
- California, United States
Daniel Lai Work
- 2025 -now Sr TPM @
- 2022 -2025 Technical Operations @
- 2021 -2022 Product Manager @
- 2018 -2021 Technical Program Manager @
- 2017 -2018 Senior Process Engineer @
- 2014 -2017 Senior Product Engineer @
- 2012 -2014 Product Engineer @
Daniel Lai Education
- National Tsing Hua University
Master of Science (MS) (Mechanical Engineering)
- National Taiwan University
Bachelor of Science (BS) (NTU Basketball Team, NTU ESOE Student Assoiciation)
Daniel Lai Skills
- Semiconductors
- Microfabrication
- Semiconductor Process
- Solidworks
- Wet Chemical Etching
- Troubleshooting
- Reactive Ion Etching
- Product Support
- CMP
- Semiconductor equipment
- System Testing
- Plasma Etching
- Electrochemical deposition
- Conductor Etch
- Thin film measurement
- Metrology
- Cross-functional Team Leadership
- MEMS
- Design of Experiments (DOE)
- Failure Analysis
- OriginLab
- Cadence Virtuoso
- Mtbf
- Semiconductor Packaging
- Electroplating
- FMEA
- Mems Process
- COMSOL
- Support
- Network Analyzer
- 8D Problem Solving
- Finite Element Analysis
- Rf Mems
- Ansoft Hfss
- ANSYS
- Wlp
- SEM
- Simulations
- Research
- Coventor
Daniel Lai Summary
- Daniel Lai, based in California, United States, is currently a Sr TPM at NVIDIA. Daniel Lai brings experience from previous roles at Apple, Applied Materials, Goertek Electronics and Lam Research. Daniel Lai holds a Master of Science (MS) in Mechanical Engineering @ National Tsing Hua University. With a robust skill set that includes Semiconductors, Microfabrication, Semiconductor Process, Solidworks, Wet Chemical Etching and more. Daniel Lai has 3 emails and 4 mobile phone numbers on RocketReach.
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