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Daniel Lai Location
California, United States
Daniel Lai Work
Sr Technical Program Manager @ (December 2025 - Present)
Sr TPM @ (December 2025 - Present)
Technical Operations @ (January 2022 - December 2025)
Product Manager @ (March 2021 - January 2022)
Technical Program Manager @ (October 2018 - March 2021)
Senior Process Engineer @ (August 2017 - October 2018)
Senior Product Engineer @ (August 2014 - August 2017)
Product Engineer @ (September 2012 - August 2014)
Daniel Lai Education
National Tsing Hua University
Master of Science (MS) (Mechanical Engineering)
National Taiwan University
Bachelor of Science (BS)
Daniel Lai Skills
Semiconductors
Microfabrication
Semiconductor Process
Solidworks
Wet Chemical Etching
Troubleshooting
Reactive Ion Etching
Product Support
CMP
Semiconductor equipment
System Testing
Plasma Etching
Electrochemical deposition
Conductor Etch
Thin film measurement
Metrology
Cross-functional Team Leadership
MEMS
Design of Experiments (DOE)
Failure Analysis
OriginLab
Cadence Virtuoso
Mtbf
Semiconductor Packaging
Electroplating
FMEA
Mems Process
COMSOL
Support
Network Analyzer
8D Problem Solving
Finite Element Analysis
Rf Mems
Ansoft Hfss
ANSYS
Wlp
SEM
Simulations
Research
Coventor
Daniel Lai Summary
Daniel Lai, based in California, United States, is currently a Sr Technical Program Manager at NVIDIA. Daniel Lai brings experience from previous roles at NVIDIA, Apple, Applied Materials and Goertek Electronics. Daniel Lai holds a Master of Science (MS) in Mechanical Engineering @ National Tsing Hua University. With a robust skill set that includes Semiconductors, Microfabrication, Semiconductor Process, Solidworks, Wet Chemical Etching and more. Daniel Lai has 3 emails and 4 mobile phone numbers on RocketReach.
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