Dan Hoffman Email & Phone Number
Director of Engineering @ Blink Device Company
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Dan Hoffman Location
- Seattle, WA, US
Dan Hoffman Work
- Director of Engineering @ (January 2024 - Present)
- Senior Engineering Manager @ (February 2023 - January 2024)
- Lead Engineer @ (February 2022 - March 2023)
- Lead Product Design Engineer @ (May 2016 - February 2022)
- Product Design Engineer @ (August 2013 - May 2016)
- Mechanical Engineer @ Byrne Thermodynamic Systems (May 2012 - May 2013)
- Engineering Intern @ (June 2011 - August 2011)
- Engineering Intern @ (June 2010 - August 2010)
- Engineering Intern @ Byrne Invent, Inc. (June 2010 - August 2010)
- Engineering Intern @ (June 2009 - August 2009)
Dan Hoffman Education
- University of Colorado Boulder
BS (Mechanical Engineering)
2009-2012 - Oregon State University
BS (Mechanical Engineering)
2007-2009
Dan Hoffman Summary
- Dan Hoffman, based in Seattle, WA, US, is currently a Director of Engineering at Blink Device Company. Dan Hoffman brings experience from previous roles at Monod Bio, Blink Device Company and Micronics Inc.. Dan Hoffman holds a 2009 - 2012 BS in Mechanical Engineering @ University of Colorado Boulder. Dan Hoffman has 2 emails and 1 mobile phone numbers on RocketReach.
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