Dan Hoffman Email & Phone Number
Director of Engineering @ Blink Device Company
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Dan Hoffman Location
- Seattle, WA, US
Dan Hoffman Work
- 2024 -now Director of Engineering @
- 2023 -2024 Senior Engineering Manager @
- 2022 -2023 Lead Engineer @
- 2016 -2022 Lead Product Design Engineer @
- 2013 -2016 Product Design Engineer @
- 2012 -2013 Mechanical Engineer @ Byrne Thermodynamic Systems
- 2011 -2011 Engineering Intern @
- 2010 -2010 Engineering Intern @
- 2010 -2010 Engineering Intern @ Byrne Invent, Inc.
- 2009 -2009 Engineering Intern @
Dan Hoffman Education
- University of Colorado Boulder
BS (Mechanical Engineering)
2009-2012 - Oregon State University
BS (Mechanical Engineering)
2007-2009
Dan Hoffman Summary
- Dan Hoffman, based in Seattle, WA, US, is currently a Director of Engineering at Blink Device Company. Dan Hoffman brings experience from previous roles at Monod Bio, Blink Device Company and Micronics Inc.. Dan Hoffman holds a 2009 - 2012 BS in Mechanical Engineering @ University of Colorado Boulder. Dan Hoffman has 1 emails and 1 mobile phone numbers on RocketReach.
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