Curtis Reed Email & Phone Number
Director of Firmware and DSP @ HARMAN International
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Curtis Reed Location
- Salt Lake City, UT, US
Curtis Reed Work
- 2021 -now Director of Firmware and DSP @
- 2018 -2021 Engineering Site Lead @
- 2012 -2018 Director of Engineering - Signal Processing Division @
- 2004 -2006 Senior Software Engineering Manager - dbx Professinal @
- 2006 -2008 Director of Engineering - BSS Audio @
- 2008 -2012 Business Segment Director - Installed and Portable PA Sound @
- 1998 -2004 DSP Engineer - dbx Professional @
- 1996 -1998 DSP Engineer - DOD Electronics @
Curtis Reed Education
- Utah State University
Bachlor (Electrical Engineering)
- Utah State University
Master of Science (Electrical Engineering)
Curtis Reed Skills
- Digital Signal Processors
- Audio Processing
- Embedded Systems
- Sound
- Embedded Software
- Signal Processing
- Electronics
- Firmware
- Acoustics
- Digital Signal Processing
- Microcontrollers
- Embedded C
- FPGA
- ARM
- RTOS
- Algorithms
- C
- Audio Engineering
- AV
- Digital Electronics
- Hardware
- Processors
- Product Development
- Software Engineering
- Systems Engineering
- Video Conferencing
- Debugging
- Electrical Engineering
- Engineering
- Engineering Management
- Hardware Architecture
- Professional Audio
- Programming
- Software Design
- Streaming Media
- System Architecture
- System Design
- Sales
- Rex
- Customer Service
- Aerospace
- Recording
- Pro Tools
- SAN
- DSP
- Software Development
- SQL
Curtis Reed Summary
- Curtis Reed, based in Salt Lake City, UT, US, is currently a Director of Firmware and DSP at HARMAN International. Curtis Reed brings experience from previous roles at Bose Corporation and Harman International. Curtis Reed holds a Bachlor in Electrical Engineering @ Utah State University. With a robust skill set that includes Digital Signal Processors, Audio Processing, Embedded Systems, Sound, Embedded Software and more. Curtis Reed has 2 emails and 1 mobile phone numbers on RocketReach.
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