2005 -
2005 Device Package Engineering Intern @ NEC Electronics, JISSO and Production Technologies Laboratories
Christopher Healy Education
Georgia Institute of Technology
Master of Science (MS) (Mechanical Engineering)
2004
-
2006
Georgia Institute of Technology
Bachelor of Science (BS) (Mechanical Engineering)
2000
-
2003
Christopher Healy Skills
Subcontractor Managmement
Simulations
Semiconductors
Product Development
Embedded Systems
Electronics
Technical Leadership
Integrated Circuits Ic
Engineering Management
Manufacturing
Design of Experiments
Failure Analysis
Fabless Manufacturing
Ic Packaging
Integrated Circuits
Christopher Healy Summary
Christopher Healy, based in Austin, TX, US, is currently a Packaging Technology Engineer at Cirrus Logic. Christopher Healy brings experience from previous roles at Qualcomm. Christopher Healy holds a 2004 - 2006 Master of Science (MS) in Mechanical Engineering @ Georgia Institute of Technology. With a robust skill set that includes Subcontractor Managmement, Simulations, Semiconductors, Product Development, Embedded Systems and more. Christopher Healy has 2 emails and 1 mobile phone numbers on RocketReach.
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