Senior Staff IC Packaging Engineer @ (May 2016 - January 2019)
Staff IC Packaging Engineer @ (October 2012 - May 2016)
Senior IC Packaging Engineer @ (October 2009 - October 2012)
IC Packaging Engineer @ (July 2007 - October 2009)
Intermediate IC Packaging Engineer @ (June 2006 - July 2007)
Device Package Engineering Intern @ NEC Electronics, JISSO and Production Technologies Laboratories (June 2005 - December 2005)
Christopher Healy Education
Georgia Institute of Technology
Master of Science (MS) (Mechanical Engineering)
2004-2006
Georgia Institute of Technology
Bachelor of Science (BS) (Mechanical Engineering)
2000-2003
Christopher Healy Skills
Design of Experiments
Electronics
Embedded Systems
Engineering Management
Fabless Manufacturing
Failure Analysis
IC packaging
Integrated Circuits (IC)
Manufacturing
Product Development
Semiconductors
Simulations
Subcontractor Managmement
Technical Leadership
Integrated Circuits Ic
Integrated Circuits
Christopher Healy Summary
Christopher Healy, based in Austin, TX, US, is currently a Packaging Technology Engineer at Cirrus Logic. Christopher Healy brings experience from previous roles at Qualcomm. Christopher Healy holds a 2004 - 2006 Master of Science (MS) in Mechanical Engineering @ Georgia Institute of Technology. With a robust skill set that includes Design of Experiments, Electronics, Embedded Systems, Engineering Management, Fabless Manufacturing and more. Christopher Healy has 2 emails and 1 mobile phone numbers on RocketReach.
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