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Chris Eickhoff Location
Wake Forest, NC, US
Chris Eickhoff Work
Senior Director, R and D Package Engineering @ (June 2023 - Present)
Director, R and D Package Engineering @ (June 2017 - June 2023)
Senior Manager, Package Engineering @ (August 2015 - June 2017)
Manager, Package Engineering @ (June 2013 - July 2015)
Senior Packaging Engineer @ (March 2006 - June 2013)
Project Engineer @ (August 2005 - March 2006)
Project Engineer @ (July 2003 - August 2005)
Product Development Engineer @ (June 2002 - July 2003)
Engineering Intern @ (June 2000 - January 2002)
Chris Eickhoff Education
University of Illinois Urbana-Champaign
BS (Mechanical Engineering)
1998-2002
Chris Eickhoff Skills
Management
Packaging
Product Development
Product Design
Plastics
Engineering
Project Management
Quality Control
Consumer Products
Manufacturing
Packaging Engineering
Lean Manufacturing
Cross-functional Team Leadership
Continuous Improvement
Injection Molding
R&D
Personal Care
Supply Chain
Six Sigma
Product Innovation
Supply Chain Management
ISO
Cosmetics
3D Modeling
Rapid Prototyping
Technical Drawing
Blow Molding
Manufacturing Operations Management
Quality System
ISO Standards
Packaging Design
Research and Development (R&D)
PowerPoint
Ticketing
Java
Microsoft Word
Cross Functional Team Leadership
Customer Service
Leadership
Microsoft Office
SQL
Project Planning
Chris Eickhoff Summary
Chris Eickhoff, based in Wake Forest, NC, US, is currently a Senior Director, R and D Package Engineering at Revlon. Chris Eickhoff brings experience from previous roles at Revlon. Chris Eickhoff holds a 1998 - 2002 BS in Mechanical Engineering @ University of Illinois Urbana-Champaign. With a robust skill set that includes Management, Packaging, Product Development, Product Design, Plastics and more. Chris Eickhoff has 3 emails and 2 mobile phone numbers on RocketReach.
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