If you need more lookups,
subscriptions start at $34 USD/month.
Chris Eickhoff Location
Wake Forest, NC, US
Chris Eickhoff Work
2023 -now Senior Director, R and D Package Engineering @
2017 -2023 Director, R and D Package Engineering @
2015 -2017 Senior Manager, Package Engineering @
2013 -2015 Manager, Package Engineering @
2006 -2013 Senior Packaging Engineer @
2005 -2006 Project Engineer @
2003 -2005 Project Engineer @
2002 -2003 Product Development Engineer @
2000 -2002 Engineering Intern @ Corpak MedSystems
Chris Eickhoff Education
University of Illinois Urbana-Champaign
BS (Mechanical Engineering)
1998-2002
Chris Eickhoff Skills
Management
Packaging
Product Development
Product Design
Plastics
Engineering
Project Management
Quality Control
Consumer Products
Manufacturing
Packaging Engineering
Lean Manufacturing
Cross-functional Team Leadership
Continuous Improvement
Injection Molding
R&D
Personal Care
Supply Chain
Six Sigma
Product Innovation
Supply Chain Management
ISO
Cosmetics
3D Modeling
Rapid Prototyping
Technical Drawing
Blow Molding
Manufacturing Operations Management
Quality System
ISO Standards
Packaging Design
Research and Development (R&D)
PowerPoint
Ticketing
Java
Microsoft Word
Cross Functional Team Leadership
Customer Service
Leadership
Microsoft Office
SQL
Project Planning
Chris Eickhoff Summary
Chris Eickhoff, based in Wake Forest, NC, US, is currently a Senior Director, R and D Package Engineering at Revlon. Chris Eickhoff brings experience from previous roles at Revlon. Chris Eickhoff holds a 1998 - 2002 BS in Mechanical Engineering @ University of Illinois Urbana-Champaign. With a robust skill set that includes Management, Packaging, Product Development, Product Design, Plastics and more. Chris Eickhoff has 2 emails and 2 mobile phone numbers on RocketReach.
Looking for a different Chris Eickhoff?
Find contact details for 700 million professionals.