Brian Wu Email
Mechanical Engineer @ Paladin Engineering
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Brian Wu Location
- California, United States
Brian Wu Work
- Mechanical Engineer @ (January 2026 - Present)
- Packaging Engineering Intern @ (June 2025 - September 2025)
- Packaging Engineering Intern @ (September 2024 - December 2024)
- Graduate Student Research Assistant @ UCLA Di Carlo Microfluidics Laboratory (June 2024 - August 2024)
- Academic Part-Time Mechanical Engineering Intern @ (September 2023 - February 2024)
- Electronic Packaging and Manufacturing Systems Engineering Intern @ (June 2023 - August 2023)
- Flight Team Lead @ 3D4E UCLA (July 2022 - June 2023)
- Makerspace Technician @ (March 2022 - June 2023)
- Mechanical Engineering Intern @ (March 2022 - September 2022)
- Flight Team Engineer @ 3D4E UCLA (October 2020 - June 2022)
- Private Swim Instructor @ (June 2019 - August 2019)
Brian Wu Education
- UCLA
Master of Science - MS (Mechanical Engineering)
2024-2025 - UCLA
Bachelor of Science - BS (Mechanical Engineering)
2020-2024
Brian Wu Summary
- Brian Wu, based in California, United States, is currently a Mechanical Engineer at Paladin Engineering. Brian Wu brings experience from previous roles at AMD, UCLA Di Carlo Microfluidics Laboratory and NASA Jet Propulsion Laboratory. Brian Wu holds a 2024 - 2025 Master of Science - MS in Mechanical Engineering @ UCLA. Brian Wu has 1 emails on RocketReach.
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