Brian Wu Email
Mechanical Engineer @ Paladin Engineering
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Brian Wu Location
- California, United States
Brian Wu Work
- 2026 -now Mechanical Engineer @
- 2025 -2025 Packaging Engineering Intern @
- 2024 -2024 Packaging Engineering Intern @
- 2024 -2024 Graduate Student Research Assistant @ UCLA Di Carlo Microfluidics Laboratory
- 2023 -2024 Academic Part-Time Mechanical Engineering Intern @
- 2023 -2023 Electronic Packaging and Manufacturing Systems Engineering Intern @
- 2022 -2023 Flight Team Lead @ 3D4E UCLA
- 2022 -2023 Makerspace Technician @
- 2022 -2022 Mechanical Engineering Intern @
- 2020 -2022 Flight Team Engineer @ 3D4E UCLA
- 2019 -2019 Private Swim Instructor @
Brian Wu Education
- UCLA
Master of Science - MS (Mechanical Engineering)
2024-2025 - UCLA
Bachelor of Science - BS (Mechanical Engineering)
2020-2024
Brian Wu Summary
- Brian Wu, based in California, United States, is currently a Mechanical Engineer at Paladin Engineering. Brian Wu brings experience from previous roles at AMD, UCLA Di Carlo Microfluidics Laboratory and NASA Jet Propulsion Laboratory. Brian Wu holds a 2024 - 2025 Master of Science - MS in Mechanical Engineering @ UCLA. Brian Wu has 1 emails on RocketReach.
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