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Brian Lucas Location
Chicago, IL, US
Brian Lucas Work
2025 -now Principal Engineer @
2021 -now Engineering Manager @
2019 -2021 Senior Packaging Engineer @
2018 -2019 Staff Packaging Engineer @
2005 -2018 Senior Engineer @
2003 -2005 CAD Systems Co-op @
2002 -2003 Draftsman @
Brian Lucas Education
University of Wisconsin-Milwaukee
Bachelor of Science (B.S.) (Mechanical Engineering)
2002-2012
Brian Lucas Skills
Packaging
Team Building
Lean Manufacturing
AutoCAD
PTC Creo
Root Cause Analysis
Plastics
Pro Engineer
FMEA
CAD
Process Improvement
Materials
Engineering
Product Design
Mechanical Engineering
Microsoft Office
Factory
Microsoft Excel
Design for Manufacturing
Machining
Manufacturing
Inventor
Solidworks
Project Management
Product Development
Computer Aided Design Cad
Continuous Improvement
Computer Aided Design
Brian Lucas Summary
Brian Lucas, based in Chicago, IL, US, is currently a Principal Engineer at Packaging Solutions, Inc.. Brian Lucas brings experience from previous roles at Packaging Solutions, Inc. and Johnson Controls. Brian Lucas holds a 2002 - 2012 Bachelor of Science (B.S.) in Mechanical Engineering @ University of Wisconsin-Milwaukee. With a robust skill set that includes Packaging, Team Building, Lean Manufacturing, AutoCAD, PTC Creo and more. Brian Lucas has 2 emails and 3 mobile phone numbers on RocketReach.
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