Brian Lucas Email & Phone Number
Principal Engineer @ Packaging Solutions, Inc.
5 free lookup(s).
If you need more lookups,
subscriptions start at $34 USD/month.
Brian Lucas Location
- Chicago, IL, US
Brian Lucas Work
- Principal Engineer @ (November 2025 - Present)
- Engineering Manager @ (January 2021 - Present)
- Senior Packaging Engineer @ (January 2019 - January 2021)
- Staff Packaging Engineer @ (January 2018 - January 2019)
- Senior Engineer @ (May 2005 - January 2018)
- CAD Systems Co-op @ (October 2003 - May 2005)
- Draftsman @ (May 2002 - October 2003)
Brian Lucas Education
- University of Wisconsin-Milwaukee
Bachelor of Science (B.S.) (Mechanical Engineering)
2002-2012
Brian Lucas Skills
- AutoCAD
- CAD
- Computer-Aided Design (CAD)
- Continuous Improvement
- Design for Manufacturing
- Engineering
- FMEA
- Factory
- Inventor
- Lean Manufacturing
- Machining
- Manufacturing
- Materials
- Mechanical Engineering
- Microsoft Excel
- Microsoft Office
- PTC Creo
- Packaging
- Plastics
- Pro Engineer
- Process Improvement
- Product Design
- Product Development
- Project Management
- Relationship Building
- Root Cause Analysis
- SolidWorks
- Team Building
- Computer Aided Design Cad
- Computer Aided Design
Brian Lucas Summary
- Brian Lucas, based in Chicago, IL, US, is currently a Principal Engineer at Packaging Solutions, Inc.. Brian Lucas brings experience from previous roles at Packaging Solutions, Inc. and Johnson Controls. Brian Lucas holds a 2002 - 2012 Bachelor of Science (B.S.) in Mechanical Engineering @ University of Wisconsin-Milwaukee. With a robust skill set that includes AutoCAD, CAD, Computer-Aided Design (CAD), Continuous Improvement, Design for Manufacturing and more. Brian Lucas has 2 emails and 3 mobile phone numbers on RocketReach.
Looking for a different Brian Lucas?
Find contact details for 700 million professionals.
Top Packaging Solutions, Inc. Employees
Vince Caruso
Operations Project Manager
Milwaukee, WI, US
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co