Bo Wu Email & Phone Number
Principal R and D Hardware Engineer @ Broadcom
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Bo Wu Location
- United States
Bo Wu Work
- Principal R and D Hardware Engineer @ (February 2016 - Present)
- Visiting Student @ (November 2006 - December 2006)
- RFIC Designer @ (June 2009 - June 2010)
Bo Wu Education
- The University of Texas at Dallas
Doctor of Philosophy (Ph.D.) (IC Design)
2011-2015 - Delft University of Technology
Master of Science (M.Sc.) (Microelectronic)
2007-2010 - University of Science and Technology of China
Bachelor of Science (B.S.) (Microelectronic)
2003-2007
Bo Wu Skills
- Photoshop
- Microsoft Office
- Semiconductors
- Mixed Signal
- Sensors
- Analog
- CMOS
- Microsoft Excel
- RF
- Analog Circuit Design
- Analog Design
- Graphic Design
Bo Wu Summary
- Bo Wu, based in United States, is currently a Principal R and D Hardware Engineer at Broadcom Inc.. Bo Wu brings experience from previous roles at INRIA, France Rocquentcourt and NXP Semiconductors. Bo Wu holds a 2011 - 2015 Doctor of Philosophy (Ph.D.) in IC Design @ The University of Texas at Dallas. With a robust skill set that includes Photoshop, Microsoft Office, Semiconductors, Mixed Signal, Sensors and more. Bo Wu has 3 emails and 4 mobile phone numbers on RocketReach.
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