Bo Ding, based in Los Angeles, CA, US, is currently a Imaging System Engineer at Snap Inc.. Bo Ding brings experience from previous roles at GoPro, CSR and Siemens Corporate Research. Bo Ding holds a 2010 - 2013 MS in Imaging Science @ Rochester Institute of Technology. With a robust skill set that includes Computer Vision, Design of Experiments, Digital Image Processing, Pattern Recognition, C++ and more. Bo Ding has 3 emails and 2 mobile phone numbers on RocketReach.
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