Bernie Lin's Location
Taiwan
Bernie Lin's Work
- Ic Packaging Specialist @ TSMC
- Principal Investigator of Advanced Packaging Material Characterization Laboratory @ TSMC
- Senior Engineer @ TSMC
Bernie Lin's Education
National Tsing Hua University
Master of Business Administration (Marketing)
2011 - 2013
National Chung Hsing University
Masters (Mechanical Engineering)
2005 - 2007
Bernie Lin's Skills
Bernie Lin's Summary
Bernie Lin, based in Taiwan, is currently a Ic Packaging Specialist at TSMC, bringing experience from previous roles at TSMC. Bernie Lin holds a 2011 - 2013 Master of Business Administration in Marketing @ National Tsing Hua University. With a robust skill set that includes AutoCAD, ANSYS, Labview, Icepak, Fluent and more, Bernie Lin contributes valuable insights to the industry. Bernie Lin has 2 emails on RocketReach.