Benjamin Webb's Location
Phoenix, Arizona, United States
Benjamin Webb's Work
- Senior CAD Engineer at Mercury Systems @ Mercury Systems
- IC Package Designer @ Triple Crown
- Application Engineer @ Mentor Graphics
- Sr. IC Package and PCB Designer @ Triple Crown Consulting, San Jose, CA
- Principal Applications Engineer @ Cadence Design Systems
- Flip Chip Packaging Contractor Designer @ Intel Corporation
- Flip Chip Packaging and PCB Contractor Designer @ Rambus
- Hybrid Principal Layout Designer for IC Packaging and PCB @ Medtronic
- Design Engineer @ Amkor Technology, Inc.
- PCB Designer @ Cerprobe
Benjamin Webb's Education
- University of Advancing Computer Technology
A (Associate of Arts in Multimedia Technology)
1990 - 1996 - National Education Center
Entry Level Drafting (Electrical/Mechanical Drafting.)
1981 - 1982 - L. H. Bates Vocational
Basic electronic theory and electrical design.
Benjamin Webb's Skills
- Zuken
- Cadence
- IC Packager
- Pro/Engineer
- AutoCAD
- Microsoft Office
- IC
- Mentor Graphics (Training only)
- EDA
- MEMS
Benjamin Webb's Summary
Benjamin Webb, based in Phoenix, Arizona, United States, is currently a Senior CAD Engineer at Mercury Systems at Mercury Systems, bringing experience from previous roles at Triple Crown, Mentor Graphics, Triple Crown Consulting, San Jose, CA and Cadence Design Systems. Benjamin Webb holds a 1990 - 1996 A in Associate of Arts in Multimedia Technology @ University of Advancing Computer Technology. With a robust skill set that includes Zuken, Cadence, IC Packager, Pro/Engineer, AutoCAD and more, Benjamin Webb contributes valuable insights to the industry. Benjamin Webb has 1 email on RocketReach.
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ViewBill Conley
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