Electronic Packaging and Product Design Engineer @ Boeing
5 free lookup(s).
Benjamin Phan Location
Los Angeles, CA, US
Benjamin Phan Work
2018 -
now Electronic Packaging and Product Design Engineer @
2015 -
2015 Student Tutor @
2012 -
2012 Mechanical Engineering Intern @
Benjamin Phan Education
University of Southern California
Master of Science - MS (Electrical Engineering)
2020
-
2024
University of California, San Diego
Bachelor of Science (B.S.) (Mechanical Engineering)
2015
-
2018
Benjamin Phan Skills
PowerPoint
Social Media
Public Speaking
Soldering
AutoCAD
Electronics Packaging
Matlab
Teaching
Lego Mindstorms Ev3
3D Printing
Analytic Problem Solving
Higher Education
Research And Development R&D
Microsoft Office
Microsoft Word
Finite Element Analysis
Microsoft Excel
Interpersonal Communication
Design for Manufacturing
ANSYS
Tutoring
C++
Teamwork
Solidworks
Research
Electronics Packaging Design
Research and Development
Benjamin Phan Summary
Benjamin Phan, based in Los Angeles, CA, US, is currently a Electronic Packaging and Product Design Engineer at Boeing. Benjamin Phan brings experience from previous roles at Saddleback College and Panasonic Avionics Corporation. Benjamin Phan holds a 2020 - 2024 Master of Science - MS in Electrical Engineering @ University of Southern California. With a robust skill set that includes PowerPoint, Social Media, Public Speaking, Soldering, AutoCAD and more. Benjamin Phan has 2 emails on RocketReach.
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