Allison Ding Email & Phone Number
Interim Chief Executive Officer @ HieFo Corporation
5 free lookup(s).
Allison Ding Location
- Los Angeles, CA, US
Allison Ding Work
- 2025 - now Interim Chief Executive Officer @
- 2025 - 2025 Chief Operating Officer @
- 2024 - 2024 Senior Manager, InP Wafer Processing @
- 2022 - 2023 Manager, R and D wafer process engineering @
- 2016 - 2022 Manager, production engineering I @
- 2015 - 2016 Principal Engineer, R and D @
- 2011 - 2015 Senior Process Engineer @ Archcom Technology Inc (Hisense Group)
- 2006 - 2010 Research Assistant @
- 2007 - 2008 Teaching Assistantship @
- 2000 - 2002 Teaching Assistant @ National Chao Tung university
Allison Ding Education
- Lehigh University
Ph.D (Electrical Engineering)
2005 - 2010 - The George Washington University
M.S (Electrical Engineering)
2003 - 2005 - National Chiao Tung University
B. Eng (Electrophysics)
1995 - 2000
Allison Ding Skills
- Photolithography
- Semiconductors
- Characterization
- Physics
- Lithography
- Laser
- Etching
- AFM
- Device Characterization
- Semiconductor Process
- Optics
- Scanning Electron Microscopy
- Device Physics
- Optical System Design
- holography grating
- Mesa etching
- Thin file deposition and characterization
- Laser characterization
- Lean Six Sigma
- Green Belt
- JMP
- Design of Experiments
- R&D
- Manufacturing
- Nanotechnology
- Engineering Management
- Java
- Process Improvement
- Microsoft Word
- Scanning Electron
- Strategic Planning
- Wafer Fab
- SQL
- Thin File Deposition
- Science
- Engineering
Allison Ding Summary
- Allison Ding, based in Los Angeles, CA, US, is currently a Interim Chief Executive Officer at HieFo Corporation. Allison Ding brings experience from previous roles at HieFo Corporation and EMCORE Corporation. Allison Ding holds a 2005 - 2010 Ph.D in Electrical Engineering @ Lehigh University. With a robust skill set that includes Photolithography, Semiconductors, Characterization, Physics, Lithography and more. Allison Ding has 2 emails on RocketReach.
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