The 3D InCites platform operates under the IMAPS umbrella, delivering a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors. Content and media covers a variety of leading technologies, including device and chiplet packaging, advanced thermal solutions, AI driven packaging, 3D integration, heterogeneous integration, photonics/CPO, and next‑generation materials, to name a few. IMAPS purchased the 3D InCites platform in January 2026 from 3D InCites LLC (created and managed by Francoise von Trapp). These longstanding industry resources are now part of the IMAPS portfolio and will continue as an important technical and media platform for the advanced packaging industry.
| Website | http://www.3dincites.com |
| Employees | 2 (0 on RocketReach) |
| Founded | 2013 |
| Address | PO Box 14727 Ste 700, Pittsburgh, Pennsylvania 15221, US |
| Phone | +1 512-372-8887 |
| Technologies |
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| Industry | Semiconductor Manufacturing |
| Keywords | 3d Packaging, Market Trends, Heterogeneous Integration, Technology Trends, Semiconductor Packaging, Technical Community, Advanced Packaging, Expert Network, Decision Makers, System Integration, Thought Leadership, Electronic Packaging, Supply Chain, Microelectronics Packaging, Innovation, Chip Packaging, Technology, Wafer Level Packaging, Semiconductors |
| Competitors | SEMI, IC Insights, Inc., TechSearch International, 3D Systems Corporation, MEMS Journal, Inc., Applied Materials, חנות, Yole Développement, IoT World, 7th Wave, Inc. - Nanotechnology Now +32 more (view full list) |
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3D InCites is based in Pittsburgh, Pennsylvania.
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