Doctor of Philosophy (Materials Science, Engineering)
1991 - 1994
Harbin Institute of Technology
Master of Science (Materials Science, Engineering)
1988 - 1991
Dalian Jiaotong University
Bachelor of Science
1984 - 1988
Zongrong Liu's Skills
Failure Analysis
Design of Experiments
Characterization
IC
Thin Films
MEMS
Research and Development
Integrated Circuits
Photolithography
Semiconductors
Zongrong Liu's Summary
Zongrong Liu, based in Pleasanton, CA, US, is currently a Senior Principal Engineer at Futurewei Technologies, bringing experience from previous roles at Western Digital, Formfactor Inc., Vertical Circuits and Ohmcraft. Zongrong Liu holds a 1999 - 2004 Doctor of Philosophy in Mechanical Engineering @ University at Buffalo. With a robust skill set that includes Failure Analysis, Design of Experiments, Characterization, IC, Thin Films and more, Zongrong Liu contributes valuable insights to the industry. Zongrong Liu has 1 email on RocketReach.