Ziptronix, Inc. Information

Ziptronix, a leader in developing next-generation semiconductor integration strategies and processes, makes tomorrow’s high performance IC applications available today. Based on the patented low temperature wafer bonding process, ZiBond® technology, and low temperature wafer bonding with buried interconnect, Direct Bond Interconnect (DBI®) technology, enable 3D architectures with the smallest footprint and volumetric size of any technologies available. DBI® technology further improves the performance, increases density, and improves device yield, while providing the lowest cost solution. Backed by the most advanced 3D technologies available, Ziptronix is your partner today and for the future.

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Website	http://www.ziptronix.com
Revenue	$1.8 million
Funding	$35.1 million
Employees	6 (3 on RocketReach)
Founded	2000
Address	5400 Glenwood Ave STE G05, Raleigh, North Carolina 27612, US
Phone	(919) 459-2400
Fax	(919) 459-2411
Technologies	JavaScript, Microsoft Outlook, Microsoft Exchange Online +4 more (view full list)
Industry	Electronics, Manufacturing, Semiconductor Manufacturing, Semiconductor & Semiconductor Equipment, 3D Technology, Ziptronix: The Foundation of 3D Integrated Circuits, Hardware, ZiBond® Technology: Direct, Low Temperature Bonding, Software, DBI® Technology: Direct, LTB w Interconnect at bond, Developer Tools, Licensing technologies to companies around the globe, Consumer Electronics, Semiconductor, Science and Engineering
Competitors	Achronix Semiconductor Corporation, Lattice Semiconductor, Nangate, R2 Semiconductor, Inc.
SIC	SIC Code 367 Companies, SIC Code 36 Companies
NAICS	NAICS Code 33 Companies, NAICS Code 334 Companies, NAICS Code 3344 Companies, NAICS Code 33441 Companies