Yuan Email & Phone Number

Sr Chip Packaging R and D Engineer @ Intel Corporation

5 free lookup(s).

Yuan Location

Los Angeles, CA, US

Yuan Work

2021 - now Sr Chip Packaging R and D Engineer @ Intel Corporation
2018 - 2021 Research Scientist @ UCLA Henry Samueli School of Engineering and Applied Science
2017 - 2018 Research Associate @ National Institute of Standards and Technology (NIST)

2011 - 2016 Graduate Research Assitant @ University of Rochester
2013 - 2013 Visiting PHD Student @ University of Colorado Boulder

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Yuan Education

University of Rochester
2011 - 2016
Zhejiang University
2007 - 2011

Yuan Skills

Memory
Polymer Physics
Diffusion

Chemistry
Insurance
Undergraduate
Direct Market Access
Mentoring
Access Control
FTIR

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Yuan Summary

Yuan, based in Los Angeles, CA, US, is currently a Sr Chip Packaging R and D Engineer at Intel Corporation. Yuan brings experience from previous roles at UCLA Henry Samueli School of Engineering and Applied Science, National Institute of Standards and Technology, University of Rochester and University of Colorado Boulder. Yuan holds a 2011 - 2016 University of Rochester. With a robust skill set that includes Memory, Polymer Physics, Diffusion, Chemistry, Insurance and more. Yuan has 2 emails and 1 mobile phone numbers on RocketReach.

Yuan Emails

Found 2 emails

Yuan Phone Numbers

Found 3 phone numbers

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