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Yuan Location
Los Angeles, CA, US
Yuan Work
2021 -now Sr Chip Packaging R and D Engineer @
2018 -2021 Research Scientist @
2017 -2018 Research Associate @
2011 -2016 Graduate Research Assitant @
2013 -2013 Visiting PHD Student @
Yuan Education
University of Rochester 2011-2016
Zhejiang University 2007-2011
Yuan Skills
Memory
Polymer Physics
Diffusion
Chemistry
Insurance
Undergraduate
Direct Market Access
Mentoring
Access Control
FTIR
Stress
Scholarships
Trend
Design
Science
Characterizations
Journals
Patents
Data Mining
Crystallization
Featured
Actuators
Data Storage
Optics
Publications
Reaction
Networking
Sun Microsystems
Healthcare
Photography
Resin
Engineering
Medicine
Founding
Polymers
Press
Fox
News
Thermoset
Thermal
Research
Articles
Advanced Materials
Brush
Primer Design
Solvent
Combination
Laboratory
Letters
R
C
Rop
STAR
Photochemistry
Chemical Engineering
Applications
Cast
Compression
Shape
Composites
Energy
Scientific
Characterization
Macro
Breaking
Cnet
Bowman
Surface
Energy Storage
CO2
UV/Vis
Epoxy
Nature
Polymer Science
Internal Audit
Therapists
Injection Molding
International Media
Smart Materials
Shell
Data Science
Condensation
Heat
Teaching
Interfaces
Differential Scanning Calorimetry
Materials
Polymerization
Numerous Others
Network Communications
China
Incorporation
SEM
Light
Formulation
Python
Yuan Summary
Yuan, based in Los Angeles, CA, US, is currently a Sr Chip Packaging R and D Engineer at Intel Corporation. Yuan brings experience from previous roles at UCLA Henry Samueli School of Engineering and Applied Science, National Institute of Standards and Technology, University of Rochester and University of Colorado Boulder. Yuan holds a 2011 - 2016 University of Rochester. With a robust skill set that includes Memory, Polymer Physics, Diffusion, Chemistry, Insurance and more. Yuan has 2 emails and 2 mobile phone numbers on RocketReach.
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