Youngsoo Lee's Location

Santa Clara, CA, US

Youngsoo Lee's Work

  • Ic Package Architect @ Xilinx
  • 3dic Solution Architect @ Synopsys Inc
  • Senior Product Manager, CPS Solutions @ Ansys
  • Chip-Package-System Product Manager @ Ansys
  • Technical Lead, Power Integrity @ Samsung
  • Engineer, on-Chip Em and Ir @ Samsung
  • Assistant Engineer @ Samsung

Youngsoo Lee's Education

  • Pusan National University

    Masters (Computer Engineering)

    2000 - 2002
  • Pusan National University

    Bachelors (Computer Engineering)

    1995 - 2000

Youngsoo Lee's Skills

  • Thermal Power Plant
  • Product Management
  • HACCP
  • Debugging
  • Drainage
  • Analog
  • Semiconductors
  • Mixed Signal
  • Hardware
  • Customer Relations

Youngsoo Lee's Summary

Youngsoo Lee, based in Santa Clara, CA, US, is currently a Ic Package Architect at Xilinx, bringing experience from previous roles at Synopsys Inc, Ansys, Inc. and Samsung. Youngsoo Lee holds a 2000 - 2002 Masters in Computer Engineering @ Pusan National University. With a robust skill set that includes Thermal Power Plant, Product Management, HACCP, Debugging, Drainage and more, Youngsoo Lee contributes valuable insights to the industry. Youngsoo Lee has 5 emails on RocketReach.

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