Young Yang's Location

San Francisco, California, United States

Young Yang's Work

  • Vice President of Hardware Engineering @ Samsung
  • Engineer @ Apple
  • Senior Packaging and Reliability Engineer @ Tessera

Young Yang's Education

  • Korea Advanced Institute of Science and Technology

    Doctor Of Philosophy (Engineering, Mechanical Engineering, Philosophy)

    1994 - 1998

Young Yang's Skills

  • Packaging Engineering
  • Engineering
  • Manufacturing
  • ArtiosCAD
  • Corrugated

Young Yang's Summary

Young Yang, based in San Francisco, California, United States, is currently a Vice President of Hardware Engineering at Samsung, bringing experience from previous roles at Apple, Tessera, Massachusetts Institute of Technology (Mit) and Samsung. Young Yang holds a 1994 - 1998 Doctor Of Philosophy in Engineering, Mechanical Engineering, Philosophy @ Korea Advanced Institute of Science and Technology. With a robust skill set that includes Packaging Engineering, Engineering, Manufacturing, ArtiosCAD, Corrugated and more, Young Yang contributes valuable insights to the industry. Young Yang has 2 emails and 1 mobile phone number on RocketReach.

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