Ying Yang Email & Phone Number
Senior Package Reliability Engineer @ MICRON SEMICONDUCTOR ASIA PTE. LTD. (Branch)
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Ying Yang Location
- Singapore
Ying Yang Work
- Senior Package Reliability Engineer @ (March 2023 - Present)
- Backend Manufacturing Quality Assurance - Senior Engineer @ (October 2014 - February 2023)
- Senior Product Quality Assurance Engineer @ (March 2014 - September 2014)
- Project Officer @ School of Materials Science and Engineering (August 2006 - September 2012)
Ying Yang Education
- Nanyang Technological University
PhD (thin film characterization, Semiconductor, packaging reliability, failure analysis)
2006-2013 - Nanyang Technological University
Bachelor with 1st class honor (Materials Science and Engineering)
2002-2006 - NUS
Bridging Course for MOE Scholars (English and Science)
2000-2002
Ying Yang Skills
- Characterization
- Semiconductors
- Soldering
- Research
- SEM
- Electroless plating
- Packaging reliability
- Thin film XRD
- Thin film metallization in semiconductors
Ying Yang Summary
- Ying Yang, based in Singapore, is currently a Senior Package Reliability Engineer at MICRON SEMICONDUCTOR ASIA PTE. LTD. (Branch). Ying Yang brings experience from previous roles at Micron Semiconductor Asia and School of Materials Science and Engineering. Ying Yang holds a 2006 - 2013 PhD in thin film characterization, Semiconductor, packaging reliability, failure analysis @ Nanyang Technological University. With a robust skill set that includes Characterization, Semiconductors, Soldering, Research, SEM and more. Ying Yang has 2 emails and 1 mobile phone numbers on RocketReach.
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