Yang Wen Email & Phone Number
Packaging R and D Engineer @ Intel Corporation
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Yang Wen Location
- Phoenix, AZ, US
Yang Wen Work
- 2022 -now Packaging R and D Engineer @
- 2017 -2022 Research Advancement @
- 2016 -2017 Faculty Associate @
- 2014 -2016 Postdoctoral Research Associate @
- 2011 -2014 Graduate Research Assistant @
- 2010 -2011 Graduate Research Assistant @
- 2007 -2008 Undergraduate Research Assistant @
Yang Wen Education
- University of Maryland College Park
Doctor of Philosophy (Ph.D.) (Chemical Engineering)
2011-2014 - University of Maryland College Park
Master's Degree (Chemistry)
2009-2011 - Harbin Institute of Technology
Bachelor's Degree (Materials Chemistry)
2004-2008
Yang Wen Skills
- Nuclear Magnetic Resonance Nmr
- Spectroscopy
- Tape Casting
- Chemistry
- Materials Science
- Aerosol Technique
- Scanning Electron Microscopy
- Solid State Synthesis
- Powder X Ray Diffraction
- Sodium Ion Batteries
- Matlab
- TEM
- Thin Films
- Atomic Layer Deposition
- Openings
- Characterization
- Gc Ms
- Graphene Synthesis
- Electrochemical Characterization
- Microsoft Office
- Electrochemistry
- Raman Spetroscopy
- Electrode Coating And Thin Film Fabrication
- Uv Vis
- Coin Cell And Pouch Cell Assembly
- CPT
- Research
- Advanced Lithium Ion Batteries
- AFM
- UV/Vis
- Microscopy
- Nanotechnology
- Nuclear Magnetic Resonance
Yang Wen Summary
- Yang Wen, based in Phoenix, AZ, US, is currently a Packaging R and D Engineer at Intel Corporation. Yang Wen brings experience from previous roles at Arizona State University, Energy Research Center (UMERC), University of Maryland and Department of Chemical & Biomolecular Engineering, University of Maryland. Yang Wen holds a 2011 - 2014 Doctor of Philosophy (Ph.D.) in Chemical Engineering @ University of Maryland College Park. With a robust skill set that includes Nuclear Magnetic Resonance Nmr, Spectroscopy, Tape Casting, Chemistry, Materials Science and more. Yang Wen has 3 emails and 1 mobile phone numbers on RocketReach.
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