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Yang Jiao Location
San Jose, CA, US
Yang Jiao Work
2025 -now Chip packaging technologist @
2022 -2025 IC Packaging Technologist @
2021 -2022 Staff IC Packaging Engineer |Semiconductor Assembly and Packaging Materials Integration Lead @
2017 -2021 IC Packaging R and D Engineer @
2017 -2017 Research Engineer @ Inmondo Tech
2012 -2017 Graduate Research Assistant @
2015 -2016 Venture Investment Analyst @
2013 -2015 Graduate Teaching Assistant @
2012 -2012 Research Assistant @
2011 -2011 R and D Internship @
2009 -2011 Research Assistant @
Yang Jiao Education
Georgia Institute of Technology
Doctor of Philosophy (Ph.D.) (Chemical Engineering)
2012-2017
Tianjin University
Bachelor of Science (BS) (Chemical Engineering)
2008-2012
Yang Jiao Skills
Powder X-ray Diffraction
TGA
Nanotechnology
FTIR
Raman Spectroscopy
SEM
XPS
Aspen Plus
TEM
Matlab
R
Simulations
Research and Development (R&D)
Polymers
Chemical Engineering
Yang Jiao Summary
Yang Jiao, based in San Jose, CA, US, is currently a Chip packaging technologist at Google. Yang Jiao brings experience from previous roles at Google, Intel Corporation and Inmondo Tech. Yang Jiao holds a 2012 - 2017 Doctor of Philosophy (Ph.D.) in Chemical Engineering @ Georgia Institute of Technology. With a robust skill set that includes Powder X-ray Diffraction, TGA, Nanotechnology, FTIR, Raman Spectroscopy and more. Yang Jiao has 4 emails and 1 mobile phone numbers on RocketReach.
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