IC Packaging Technologist @ (August 2022 - May 2025)
Staff IC Packaging Engineer |Semiconductor Assembly and Packaging Materials Integration Lead @ (December 2021 - August 2022)
IC Packaging R and D Engineer @ (October 2017 - November 2021)
Research Engineer @ Inmondo Tech (September 2017 - September 2017)
Graduate Research Assistant @ (August 2012 - July 2017)
Graduate Teaching Assistant @ (August 2013 - May 2015)
Venture Investment Analyst @ (June 2015 - January 2016)
Research Assistant @ (January 2012 - June 2012)
R and D Internship @ (June 2011 - August 2011)
Research Assistant @ (August 2009 - May 2011)
Yang Jiao Education
Georgia Institute of Technology
Doctor of Philosophy (Ph.D.) (Chemical Engineering)
2012-2017
天津大学
Bachelor of Science (BS) (Chemical Engineering)
2008-2012
Yang Jiao Skills
Powder X-ray Diffraction
TGA
Nanotechnology
FTIR
Raman Spectroscopy
SEM
XPS
Aspen Plus
TEM
Matlab
R
Simulations
Research and Development (R&D)
Polymers
Chemical Engineering
Yang Jiao Summary
Yang Jiao, based in San Jose, CA, US, is currently a Chip packaging technologist at Google. Yang Jiao brings experience from previous roles at Google, Intel Corporation and Inmondo Tech. Yang Jiao holds a 2012 - 2017 Doctor of Philosophy (Ph.D.) in Chemical Engineering @ Georgia Institute of Technology. With a robust skill set that includes Powder X-ray Diffraction, TGA, Nanotechnology, FTIR, Raman Spectroscopy and more. Yang Jiao has 4 emails and 1 mobile phone numbers on RocketReach.
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